Two-phase immersion and heat sink, communication device and manufacturing method thereof

A heat dissipation device and heat source technology, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., to achieve the effect of solving high-density heat dissipation problems
CN103298312AInactive Publication Date: 2013-09-11HUAWEI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUAWEI TECH CO LTD
Publication Date
2013-09-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a two-phase immersion and heat sink, a communication device and a manufacturing method thereof. The two-phase immersion and heat sink comprises a sealing shell (101), pipelines (102) and a condenser (103), wherein the sealing shell (101) is connected with the condenser (103) through the pipelines (102), a cavity of the sealing shell (101) is used for containing insulation working media and heat source components, the pipelines (102) are connected with the condenser (103) through the pipelines (102), the cavity of the sealing shell (101) and a cavity of the condenser (103) form a closed loop, the condenser (103) is located at the position above the sealing shell (101), a connector is arranged on the wall face of the sealing shell (101), and the connector is electrically connected with the inside of the sealing shell (101)and the outside of the sealing shell (101). By means of the scheme, not only is the problem of high-density heat dissipation solved, but also the requirements of different application scenarios are met, and the scheme is developed smoothly.
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Description

technical field

[0001] The invention relates to the technical field of heat dissipation, in particular to a two-phase immersion heat dissipation device, communication equipment and a manufacturing method thereof. Background technique

[0002] With the rapid development of the Information Communication Technology (ICT) industry, the integration and thermal density of equipment are getting higher and higher. Moore's Law tells us that the performance and integration of chips will double every 18 months. From the perspective of equipment integration, although the heat dissipation capacity of most data centers or core computer rooms is still at the level of 3kW / cabinet, it is not surprising that there are 20kW equipment in a single cabinet. Faced with the increasing power consumption of chips and the increasing integration of equipment, the traditional technology of using air as the medium to dissipate heat for electronic products is increasingly unable to meet the demand. The in...

Claims

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