Two-phase immersion and heat sink, communication device and manufacturing method thereof

A heat dissipation device and heat source technology, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., to achieve the effect of solving high-density heat dissipation problems

Inactive Publication Date: 2013-09-11
HUAWEI TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Embodiments of the present invention provide a two-phase immersion cooling device, communication equipment and a manufacturing method thereof, which are used to solve the problem of how to effectively dissipate heat through immersion cooling technology

Method used

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  • Two-phase immersion and heat sink, communication device and manufacturing method thereof
  • Two-phase immersion and heat sink, communication device and manufacturing method thereof
  • Two-phase immersion and heat sink, communication device and manufacturing method thereof

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Embodiment Construction

[0028] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] In the schematic diagram of the embodiment of the present invention, the black in the rectangular sealed shell The schematic diagram shows the heat source device and the single board, and will not be explained one by one in the description of the subsequent schematic diagram.

[0030] An embodiment of the present invention provides a two-phase immersion cooling device, such as figure 1 shown, please also see Figure 2-4 ,include:...

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Abstract

The invention discloses a two-phase immersion and heat sink, a communication device and a manufacturing method thereof. The two-phase immersion and heat sink comprises a sealing shell (101), pipelines (102) and a condenser (103), wherein the sealing shell (101) is connected with the condenser (103) through the pipelines (102), a cavity of the sealing shell (101) is used for containing insulation working media and heat source components, the pipelines (102) are connected with the condenser (103) through the pipelines (102), the cavity of the sealing shell (101) and a cavity of the condenser (103) form a closed loop, the condenser (103) is located at the position above the sealing shell (101), a connector is arranged on the wall face of the sealing shell (101), and the connector is electrically connected with the inside of the sealing shell (101)and the outside of the sealing shell (101). By means of the scheme, not only is the problem of high-density heat dissipation solved, but also the requirements of different application scenarios are met, and the scheme is developed smoothly.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a two-phase immersion heat dissipation device, communication equipment and a manufacturing method thereof. Background technique [0002] With the rapid development of the Information Communication Technology (ICT) industry, the integration and thermal density of equipment are getting higher and higher. Moore's Law tells us that the performance and integration of chips will double every 18 months. From the perspective of equipment integration, although the heat dissipation capacity of most data centers or core computer rooms is still at the level of 3kW / cabinet, it is not surprising that there are 20kW equipment in a single cabinet. Faced with the increasing power consumption of chips and the increasing integration of equipment, the traditional technology of using air as the medium to dissipate heat for electronic products is increasingly unable to meet the demand. The in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/203H01L23/427H01L2924/0002H01L2924/00
Inventor 罗朝霞黄书亮翟立谦柯有和
Owner HUAWEI TECH CO LTD
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