Power module and packaging method thereof

A technology for a power module and a package body, which is applied to the field of power modules and their packaging, can solve the problems of easy generation of burrs and heat dissipation on the heat dissipation surface, and achieve the effects of large wear amount, good heat dissipation performance and good contact.

Active Publication Date: 2016-01-27
吉林华微斯帕克电气有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a power module for the problem that burrs are easily generated on the heat dissipation surface of the existing power module and affect heat dissipation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Power module and packaging method thereof
  • Power module and packaging method thereof
  • Power module and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please also refer to Figure 1 to Figure 4 A power module provided by an embodiment of the present invention includes a drive circuit part 100 , a power semiconductor device part 200 , a lead frame 3 and a molded resin package 6 covering the above three parts.

[0038] Such as figure 1 As shown, the driving circuit part 100 includes a PCB board 1 , a driving chip 5 disposed on the PCB board 1 and a plurality of passive components 2 . Here, the passive component 2 is also referred to as a passive device, such as resistors, capacitors, inductors, and transformers....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention aims at the problem that burrs are easily produced on the heat dissipation surface of the existing power module, thereby affecting the heat dissipation, and provides a power module, which includes a drive circuit part, a power semiconductor device part with at least one power chip, a lead frame and a cover covering the above three parts. Part of the molded resin package, the drive circuit part includes a PCB board, a drive chip set on the PCB board and a plurality of passive components, the lead frame has a power chip base island for placing the power chip, and the power chip base island is close to one end of the PCB board At least one hook that is in contact with the front side of the PCB board is provided, and the outer surface of the molded resin package forms a heat dissipation surface at a position below the base island of the power chip, and the molded resin package forms a plurality of Thimble hole. The thimble pin hole of the power module of the present invention is formed under the PCB board, that is, during injection molding, the thimble pin is pushed against the back of the PCB board, so no burrs are formed on the heat dissipation surface, the heat dissipation surface is in good contact with the radiator, and the heat dissipation performance is good.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a power module and a packaging method thereof. Background technique [0002] Power modules are widely used in motor drives and power electronics including air conditioners, washing machines and refrigerators. The power module includes a driving circuit part and a power semiconductor device part composed of a PCB board, a driving chip and passive components, and is encapsulated in a molded resin as a whole. The working current of the power module is very large, so the heat generated by the power chip is very large under the working condition. The stronger the heat dissipation performance inside the module is required, the better the distance between the base island of the power chip and the heat dissipation surface of the module lead frame is required. The smaller the better, the higher the thermal conductivity of the filler, the better. However, in the application, th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/31H01L21/60H01L21/56
CPCH01L2924/1815H01L2224/48091H01L2224/48137H01L2224/48247H01L2924/00014
Inventor 陈鋆张礼振刘杰
Owner 吉林华微斯帕克电气有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap