Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of window opening processing technology of flexible circuit board covering layer

A flexible circuit board, processing technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as poor accuracy and difficult application, and achieve the effect of high alignment accuracy

Active Publication Date: 2015-12-02
GULTECH WUXI ELECTRONICS CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former is easy to operate and is suitable for mass production, but the height difference between the ink and the soft board cover layer may affect the welding of some precision components; The accuracy is poor, it is difficult to apply to some products with high alignment accuracy requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A process for opening a window of a flexible circuit board covering layer comprises the following steps:

[0019] a. Increase the side length or diameter of the window opening area of ​​the flexible circuit board by 0.0252mm, and use the compensated graphics as a working draft;

[0020] b. Use laser holes to fill the window area of ​​the working manuscript. The laser aperture is 0.15mm. When filling the laser holes, the distance between the centers of adjacent holes in the outermost row of laser holes is controlled at 0.04mm and is consistent with the working manuscript. The edges of the window opening area are tangent, and the distance between the centers of adjacent holes between the outermost laser holes is controlled at 0.1mm;

[0021] c. Use a laser drilling machine to produce laser windows on the working draft. The center of the laser emitter of the laser drilling machine operates according to the program set in step b, and the depression at the edge of the window...

Embodiment 2

[0029] A process for opening a window of a flexible circuit board covering layer comprises the following steps:

[0030] a. Increase the side length or diameter of the window area of ​​the flexible circuit board by 0.0127mm, and use the compensated graphics as a working draft;

[0031] b. Use laser holes to fill the window area of ​​the working manuscript. The laser aperture is 0.2mm. When filling the laser holes, the distance between the centers of adjacent holes in the outermost row of laser holes is controlled at 0.05mm and is consistent with the working manuscript. The edges of the window opening area are tangent, and the distance between the centers of adjacent holes between the outermost laser holes is controlled at 0.125mm;

[0032] c. Use a laser drilling machine to produce laser windows on the working manuscript. The center of the laser emitter of the laser drilling machine operates according to the program set in step b, and the depression at the edge of the window i...

Embodiment 3

[0040] A process for opening a window of a flexible circuit board covering layer comprises the following steps:

[0041] a. Increase the side length or diameter of the window opening area of ​​the flexible circuit board by 0.0252mm, and use the compensated graphics as a working draft;

[0042] b. Use laser holes to fill the window area of ​​the working manuscript. The laser aperture is 0.25mm. When filling the laser holes, the distance between the centers of adjacent holes between the outermost row of laser holes is controlled at 0.06mm and is consistent with the working manuscript. The edges of the window opening area are tangent, and the distance between the centers of adjacent holes between the outermost laser holes is controlled at 0.15mm;

[0043] c. Use a laser drilling machine to produce laser windows on the working manuscript. The center of the laser emitter of the laser drilling machine operates according to the program set in step b, and the depression at the edge of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a window-opening processing technology for a covering layer of a flexible circuit board. The window-opening processing technology comprises the following steps of: compensating for the area of a window-opening region, making a laser drilling procedure, performing laser drilling, preparing a cleaning solution, spraying the solution for cleaning, drying with hot air, removing glue for cleaning, washing with water, and drying with hot air. According to the window-opening processing technology disclosed by the invention, the high alignment precision requirements of window opening in a soft plate can be met, the flexibility and smoothness of the flexible circuit board can not be affected, and the window-opening processing technology is particularly suitable for window-opening production of the covering layers of flexible circuit boards, which have small sizes and high alignment precision requirements.

Description

technical field [0001] The invention relates to a window-opening process for a covering layer of a flexible circuit board, and belongs to the technical field of printed circuit board processing. Background technique [0002] With the development trend of miniaturization, integration and multi-functionalization of consumer electronics products, flexible boards and rigid-flex boards are widely used in mobile phones, tablet computers, digital Cameras, equipment control systems and other fields are more and more common. In order to meet the requirements of miniaturization and multi-functionality, the density of components and corresponding accessories is getting higher and higher, and the volume is getting smaller and smaller, and the accuracy requirements for the weldment area are also stricter. For the components or accessories on the flexible board, in addition to the precision requirements for the window opening area, there are also requirements for the bending fatigue resi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 宋阳
Owner GULTECH WUXI ELECTRONICS CO LTD