Unlock instant, AI-driven research and patent intelligence for your innovation.

Method and device for manufacturing blind holes

A blind hole and control unit technology, applied in the electronic field, can solve the problems of large errors in zero-tolerance blind holes and failure to meet requirements, and achieve the effect of accurately manufacturing zero-tolerance blind holes

Inactive Publication Date: 2013-12-18
PEKING UNIV FOUNDER GRP CO LTD +3
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides a method and device for making blind holes, which solves the technical problem in the prior art that the error is too large and cannot meet the requirements when using mechanically controlled deep drilling to make zero-tolerance blind holes

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for manufacturing blind holes
  • Method and device for manufacturing blind holes
  • Method and device for manufacturing blind holes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The embodiment of the present invention provides a method and device for making blind holes, which solves the technical problem in the prior art that the error is too large when making zero-tolerance blind holes by means of mechanically controlled deep drilling, which cannot meet the requirements.

[0025] The technical solution in the embodiment of the present invention is to solve the above-mentioned technical problems, and the general idea is as follows:

[0026] An embodiment of the present invention provides a method for making blind holes, which is applied to a printed circuit board. The printed circuit board includes at least three metal layers, and an insulating material layer is arranged between the first metal layer and the second metal layer in the three metal layers. , the blind hole is a blind hole drilled through the first metal layer and exposing the second metal layer, the method comprising:

[0027] First, control a drill bit to drill through the first ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a method and device for manufacturing blind holes. The method is applied to a printed circuit board, wherein the printed circuit board at least comprises three metal layers, an insulation material layer is arranged between the first metal layer and the second metal layer of the three metal layers, and the blind holes penetrate through the first metal layer in a drilled mode and are exposed out of the second metal layer. The method comprises the steps of controlling a drill bit to drill into the first metal layer and drill to the first position away from the second metal layer by a first distance, removing insulation materials between the first position and the second metal layer in the insulation material layer, exposing the second metal layer, and therefore completing manufacturing of the blind holes.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a method and device for making blind holes. Background technique [0002] At present, electronic products have become an indispensable main role in people's lives. With the increasing demand for electronic products, higher requirements are put forward for printed circuit boards (PCB), one of the important components of electronic products, for example, in order to increase the density of printed circuit boards and To reduce the surface area of ​​the circuit board and meet the requirements for radio communication, designs such as blind or buried holes are usually used. [0003] Please refer to figure 1 , figure 1 is a schematic diagram of a printed circuit board with a blind hole design in the prior art, such as figure 1 As shown, the printed circuit board includes three metal layers, which are the first metal layer, the second metal layer and the third metal layer, and th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
Inventor 华炎生
Owner PEKING UNIV FOUNDER GRP CO LTD