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A laser processing method

A laser processing method and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as inability to mark and difficult to achieve, and achieve the effect of laser welding

Active Publication Date: 2016-08-10
杭州银湖激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The carbon dioxide laser produces mid-infrared light with a wavelength of 10.6 microns. Assuming that the outer packaging material is glass, plastic, crystal, or semiconductor material, the carbon dioxide laser cannot pass through these packaging materials, and cannot perform laser treatment on these packaged objects. Laser processing such as marking
Other commonly used lasers for laser processing are 1-micron fiber lasers and neodymium-doped stone (YAG) lasers. , for the material to be processed, because it is a transparent or translucent organic material, a laser near 1 micron cannot perform laser processing such as marking on these objects
Therefore, the idea of ​​using transparent or translucent packaging materials to package the organic materials to be processed before laser processing is difficult to realize under the existing technology

Method used

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Embodiment 1

[0025] Embodiment one: see attached figure 1 As shown, a laser processing method uses a transparent or translucent packaging layer 2 to shield the material 3 to be processed, the packaging layer 2 and the material 3 to be processed are separately arranged, and the laser beam 1 is focused on the material to be processed through the packaging layer 2 Laser processing is performed on the processed material 3, and the wavelength of the laser beam is 1.5 microns to 4 microns.

[0026] The packaging layer 2 is transparent or translucent glass material, plastic material, crystal material or semiconductor material, used for packaging, protection and other purposes. The material 3 to be processed is a laser processed organic matter-containing material containing >50% organic matter.

[0027] The packaging layer 2 and the material 3 to be processed can also be in direct contact, such as figure 2 shown.

[0028] The packaging layer 2 can be a single-layer material or a multi-layer ma...

Embodiment 2

[0029] Embodiment 2: A marking method for laminated glass, see attached Figure 4 shown.

[0030] High-strength glass, such as bullet-resistant glass, consists of multiple layers of glass connected by bonding materials containing organic substances. as attached Figure 4 As shown, the laminated glass is composed of a first glass layer 4 , a second glass layer 6 and an adhesive material 5 containing an organic substance sandwiched between the first glass layer 4 and the second glass layer 6 . The bonding material is usually colorless and has good transmission at 1 micron wavelength. However, the adhesive material containing organic substances has absorption near 2 microns due to the C-H bond. In this embodiment, the laser beam 1 with a wavelength of 1.8 microns to 2.2 microns is used for marking. The laser beam is focused on the adhesive material 5 containing organic substances to realize marking. The mark is in the middle of the laminated glass, which is extremely difficul...

Embodiment 3

[0031] Embodiment three: see attached Figure 5 As shown, marking of organic-containing materials in one-layer plastic packaging. Organic materials have better permeability near 1 micron, so lasers near 1 micron cannot be used for marking. For example, a 1 micron Q-switched laser is difficult to effectively mark on transparent plastics. But it can be marked with a 2 micron laser. Although the packaging material may also have some absorption around 2 microns, the laser is focused on the object being marked. Because the laser energy per unit area on the packaging material is small, no marks will be left on the packaging material. This marking method is very useful in industrial production, especially on objects of relatively small size. Marking can be done after packaging. Very effective and reduces production costs. It is also very useful in pharmaceutical products. Because laser marking does not require any other substances, it is safe and reliable. Figure 5 The packa...

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Abstract

The invention discloses a laser processing method, which is characterized in that: a transparent or translucent packaging layer is used to cover, wrap or block the material to be processed, and the laser beam is focused on the material to be processed through the packaging layer to perform laser processing. processing, the wavelength of the laser beam is 1.5 microns to 4 microns. The invention packs and protects the material to be processed through the packaging layer, and then performs laser processing with a laser beam of a specific wavelength to realize laser processing of substances containing organic materials in a protected state; it can be used for automatic processing of small-sized objects, And laser welding of objects requiring special atmosphere shielded welding.

Description

technical field [0001] The invention relates to a laser processing method, in particular to a method of laser marking, cutting, drilling and welding on another material through a layer of material. Background technique [0002] Laser processing of materials is an important processing technology used in modern industry, household, office supplies, medical equipment and equipment manufacturing and other fields. For example, laser marking is not only clear and wear-resistant, but also does not require ink materials, which is very conducive to environmental protection. Laser welding does not require any solder, which not only saves costs, but also improves the mechanical strength of the material after welding. [0003] Generally, during laser processing, the laser is directly focused on the surface of the material to be processed, and the thermal effect or photochemical reaction of the laser is used to achieve the required processing. However, some materials are not suitable f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/12B23K26/00
Inventor 蒋仕彬
Owner 杭州银湖激光科技有限公司
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