A laser processing system and method

A laser processing and to-be-processed technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as low laser processing efficiency, and achieve the effect of saving time and improving efficiency

Active Publication Date: 2020-06-16
WUHAN FARLEYLASERLAB CUTTING SYST ENG
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Problems solved by technology

[0003] At present, the laser processing method is mainly: use a laser cutting machine to process the raw material, for example, laser cutting and / or laser marking on the raw material, but because the laser cutting machine uses manual loading and unloading, and raw material handling The storage of finished products is also dependent on manpower, resulting in low efficiency of laser processing

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  • A laser processing system and method
  • A laser processing system and method

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Embodiment Construction

[0054] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0055] In order to solve the problems of the prior art, embodiments of the present invention provide a laser processing system and method. The following first describes a laser processing system provided by the present invention.

[0056] See figure 1 , figure 1 This is a schematic structural diagram of a laser processing system provided by an embodiment of the present invention. The system includes an upper computer, a sorting robot, a la...

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Abstract

The invention provides a laser machining system and method. The laser machining system comprises an upper computer, a sorting robot, a laser cutting machine and a material storage server; the upper computer is used for transmitting a material taking request to the material storage server, a sorting task and a first activation instruction to the sorting robot, and a machining task and a second activation instruction to the laser cutting machine; the material storage server is used for resolving the material taking request, determining a to-be-machined raw material, and issuing the to-be-machined raw material to the sorting robot; the sorting robot is used for acquiring the to-be-machined raw material according to the sorting task after receiving the first activation instruction and conveying the to-be-machined raw material to the laser cutting machine; and the laser cutting machine is used for performing laser machining on the to-be-machined raw material according to the machining taskafter receiving the second activation instruction. With the application of the embodiment of the invention, the laser machining efficiency is improved.

Description

Technical field [0001] The invention relates to the technical field of industrial control, in particular to a laser processing system and method. Background technique [0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between the laser beam and the material to cut, weld, mark, perforate, and micromachining materials (including metals and non-metals). As an advanced manufacturing technology, laser processing technology has been widely used in industrial fields such as automobiles, electronics, electrical appliances, aviation, metallurgy, and machinery manufacturing. It has the advantages of reducing processing time, reducing processing costs, and improving workpiece quality. [0003] At present, the laser processing method is mainly: use a laser cutting machine to process raw materials, for example, laser cutting and / or laser marking the raw materials, but because the laser cutting machine uses manual manual feeding, manu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/70B25J11/00B07C5/00
CPCB07C5/00B23K26/38B23K26/70B23K26/702
Inventor 曾毅彪王杰吴苶
Owner WUHAN FARLEYLASERLAB CUTTING SYST ENG
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