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Laser processing system

A laser processing and laser technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems that transparent materials cannot adjust the focal depth and affect processing efficiency, etc.

Pending Publication Date: 2021-03-16
SHENZHEN INTE LASER TECH
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Problems solved by technology

[0004] In view of this, the present invention provides a laser processing system to solve the problem that traditional laser processing equipment cannot adjust the focal depth when processing transparent materials, thus affecting the processing efficiency

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Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] refer to figure 1 As shown, the embodiment of the present invention provides a laser processing system 10, the laser processing system 10 has a total optical axis 100, and the laser processing system 10 includes a laser 200 arranged in sequence along the total optical axis 100, a Bessel beam generator 300 and the workbench 400, the laser 200 is used to emit a laser beam toward the Bessel beam generator 300, and the workbench 400 is used to carry the workpiec...

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Abstract

The invention provides a laser processing system with a total optical axis. The laser processing system comprises a laser, a Bessel beam generator and a workbench which are sequentially arranged alongthe total optical axis, the laser is used for emitting laser beams to the Bessel beam generator, and the workbench is used for bearing a workpiece; and the Bessel beam generator is used for converting the laser beams into Bessel laser beams so as to process a workpiece on the workbench, the Bessel beam generator comprises a plurality of diffraction positions, and the plurality of diffraction positions are movable relative to the laser, so that different diffraction positions can be aligned with the total optical axis, and therefore, the Bessel laser beams with different line lengths are formed. According to the laser processing system provided by the embodiment, the Bessel beam generator with the plurality of diffraction positions is arranged, and the line lengths of the output Bessel laser beams can be adjusted according to the characteristics of the workpiece in the processing process, so that the laser processing of cutting transparent materials with different thicknesses or variable-thickness transparent materials at one time is realized.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing system. Background technique [0002] Laser processing has become an emerging technology in recent years due to its advantages of high processing efficiency and processing precision. In the process of using traditional laser processing equipment to laser process transparent materials such as glass, since laser processing equipment generally adopts a laser processing optical path with a fixed focal depth, in the processing process, when the thickness of the transparent material is greater than the preset focus of the laser processing equipment When it is deep, it is impossible to complete the cutting of the transparent material at one time. It is necessary to change the focal plane position of the laser processing equipment many times during the processing, so that the processing can be completed through multiple cutting. If the focal plane position is ...

Claims

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Application Information

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IPC IPC(8): B23K26/06B23K26/38C03B33/00
CPCB23K26/38B23K26/0604C03B33/00
Inventor 邹武兵李璟张德安段家露吴飞龙
Owner SHENZHEN INTE LASER TECH
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