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Image device and method of forming the same

A technology of image sensors and devices, which is applied in the fields of electrical solid state devices, semiconductor devices, semiconductor/solid state device manufacturing, etc., and can solve problems that cannot fully meet the requirements

Active Publication Date: 2017-03-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While existing BSI image sensor devices and methods of fabricating BSI image sensor devices generally serve their intended purpose, as devices continue to be scaled down, they are no longer fully satisfactory in all respects

Method used

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  • Image device and method of forming the same
  • Image device and method of forming the same
  • Image device and method of forming the same

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Embodiment Construction

[0030] It should be understood that the following disclosure provides many different embodiments and examples for implementing the different features of the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are merely examples and not intended to be limiting. In addition, the following description in which the first part is formed over or on the second part may include an embodiment in which the first part and the second part are formed in direct contact, and may also include an embodiment in which the first part and the second part may be formed interposed. An embodiment in which an additional part is placed between two parts so that the first part and the second part are not in direct contact. Also, relative terms such as "top", "front", "bottom" and "rear" are used to provide a correspondence between elements and not to denote any absolute direction. Various features may be arbitrarily d...

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PUM

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Abstract

The present invention discloses an image device and a method for forming the same, wherein the image sensor device includes a substrate having a pixel region and a peripheral region. A plurality of trenches are etched in the peripheral region. Each of the first grooves has a depth D1. A mask layer is formed over the substrate. In the pixel area, the mask layer has a plurality of openings. A spacer is formed in the inner surface of each opening. A plurality of second trenches are etched through each opening with the spacer in the pixel region. Each of the second trenches has a depth D2. Depth D1 is greater than depth D2.

Description

technical field [0001] The present disclosure relates to image sensor devices and methods of forming image sensor devices. Background technique [0002] An image sensor device is a building block in a digital imaging system such as a digital still camera or video camera. Image sensor devices include an array (or grid) of pixels for detecting light and recording the intensity (brightness) of the detected light. The pixel array responds to light by accumulating charge, for example, the more light there is, the more charge there is. The accumulated charge is then used, for example, by other circuits to provide color and brightness for suitable applications such as digital cameras. One type of image sensor device is a backside illuminated (BSI) image sensor device. The BSI image sensor device is used to sense the amount of light projected towards the backside of the substrate supporting the image sensor circuitry of the BSI image sensor device. The pixel grid is located on t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H01L21/027
CPCH01L21/0334H01L21/0337H01L27/14603H01L27/1464H01L27/14689H01L27/146
Inventor 陈愉婷杨敦年刘人诚施宇豪王志谦周世培黄为栋吴政达
Owner TAIWAN SEMICON MFG CO LTD