A kind of encapsulation structure and encapsulation method of oled device
A technology of encapsulation structure and encapsulation method, which is applied in the manufacture of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve problems such as device failure, prolong service life, prevent water vapor and oxygen from entering OLED devices, and provide good barrier performance effect
Active Publication Date: 2015-10-14
BOE TECH GRP CO LTD
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Problems solved by technology
For example, the OLED device is a DC current driven device. When the OLED device is in working condition, if there is water vapor inside the device, a miniature electrolytic cell will be formed inside the device, and an electrochemical reaction will occur. Separation of metal cathode from organic functional layers leading to device failure
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[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0037] Please refer to figure 1 , Figure 2a with image 3 ,in, figure 1 A schematic structural view of the OLED device packaging structure provided by the embodiment of the present invention when the OLED device is disposed on the bottom surface of the recessed part of the glass substrate; Figure 2a A schematic structural diagram of a glass substrate in an OLED device packaging structure provided by an embodiment of the present invention; image 3 A sche...
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The invention relates to the field of packaging technology, and discloses a packaging structure and a packaging method for an OLED device. The packaging structure of the OLED device includes a glass substrate, a glass cover plate, an OLED device, and a sealing layer, wherein: the glass substrate has a concave portion, and the glass cover The plate is located at the opening of the depression, and the periphery of the glass cover and the glass substrate are bonded by a glass barrier formed by melting glass powder, so that the glass cover and the glass substrate have an integrated structure, and the glass cover and the depression The part forms an airtight cavity, and the OLED device and the sealing layer are located in the airtight cavity. The above encapsulation structure realizes the all-glass encapsulation of the OLED device, and the glass material has good barrier performance to water vapor and oxygen, which can prevent water vapor and oxygen from entering the OLED device, and prolong the service life of the OLED device.
Description
technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging structure and a packaging method of an OLED device. Background technique [0002] OLED devices refer to electroluminescent devices in which organic semiconductor materials and luminescent materials emit light through carrier injection and recombination driven by an electric field. OLED devices have many advantages and have bright prospects in the display field. OLED devices are very sensitive to water vapor and oxygen, and the water vapor and oxygen that penetrate into the OLED device are the main factors that affect the life of the OLED device. Water vapor and oxygen will chemically react with organic materials, causing OLED devices to fail. For example, the OLED device is a DC current driven device. When the OLED device is in working condition, if there is water vapor inside the device, a miniature electrolytic cell will be formed inside the device, and an elec...
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IPC IPC(8): H01L51/50H01L51/52H01L51/56
CPCH10K50/8426H10K50/841H10K71/00
Inventor 张玉欣
Owner BOE TECH GRP CO LTD