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Tape for protecting semiconductor wafer surface and method for manufacturing semiconductor wafer using same

A manufacturing method and semiconductor technology, which can be used in semiconductor/solid-state device manufacturing, film/sheet-like adhesives, adhesives, etc., can solve the problems of excess glue, peeling off, and curing shrinkage, etc., to prevent chip damage. , The effect of inhibiting residual glue and reducing peeling force

Active Publication Date: 2015-07-29
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the amount of the photopolymerization initiator or the amount of the double bond that reacts with ultraviolet rays is increased, the curing shrinkage will also increase, and the adhesive will penetrate into the bumps, and when the tape is peeled off, the sticky The mixture is broken between the adhesive on the surface of the belt and the bumps, and there is a problem of residual glue
Furthermore, in the case of poor peeling or strong penetration of the adhesive into the bump, there will be a problem of peeling the bump itself from the semiconductor wafer.
[0013] In response to this problem, it is considered that adhesive residue and peeling can be improved by partially thinning the adhesive layer so that it does not follow the bumps, but usually in this method, since a gap is generated between the semiconductor wafer and the adhesive, the Intervention of radiation curing due to oxygen in voids or embedding around the semiconductor wafer becomes a problem

Method used

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  • Tape for protecting semiconductor wafer surface and method for manufacturing semiconductor wafer using same
  • Tape for protecting semiconductor wafer surface and method for manufacturing semiconductor wafer using same
  • Tape for protecting semiconductor wafer surface and method for manufacturing semiconductor wafer using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122]Polymerize 65 parts by mass of 2-ethylhexyl acrylate, 33 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid in ethyl acetate, and obtain a copolymer having a weight average molecular weight of 800,000 100 parts by mass, 60 parts by mass of ethyl methacrylate-2-isocyanato was added to obtain an acrylic copolymer. 2 parts by mass of an addition-based isocyanate-based crosslinking agent CORONET L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and a photopolymerization initiator 4,4'-bis(diethylamino) were mixed with the obtained acrylic copolymer. 2 parts by mass of benzophenone were adjusted with ethyl acetate in order to adjust the viscosity to be easy to apply, and an adhesive composition was obtained.

[0123] On a separation plate of polyethylene terephthalate (PET) with a thickness of 25 μm, the adhesive composition is coated with a film thickness of 30 μm after drying, and after drying, it is pasted on a separation plate wi...

Embodiment 2

[0125] Polymerize 72 parts by mass of 2-ethylhexyl acrylate, 26 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid in ethyl acetate, and obtain a copolymer having a weight average molecular weight of 700,000 100 parts by mass, 20 parts by mass of ethyl methacrylate-2-isocyanato was added to obtain an acrylic copolymer. 1.5 parts by mass of an addition-based isocyanate-based crosslinking agent CORONET L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and a photopolymerization initiator 4,4'-bis(diethylamino) were mixed with the obtained acrylic copolymer. 2 parts by mass of benzophenone were adjusted with ethyl acetate in order to adjust the viscosity to be easy to apply, and an adhesive composition was obtained.

[0126] On a separation plate of polyethylene terephthalate (PET) with a thickness of 25 μm, the adhesive composition is coated with a film thickness of 20 μm after drying, and after drying, it is pasted on a separation plate...

Embodiment 3

[0128] Polymerize 68 parts by mass of 2-ethylhexyl acrylate, 30 parts by mass of 2-hydroxyethyl acrylate, and 2 parts by mass of methacrylic acid in ethyl acetate, and obtain a copolymer having a weight average molecular weight of 800,000 100 parts by mass, 20 parts by mass of ethyl methacrylate-2-isocyanato was added to obtain an acrylic copolymer. 2 parts by mass of an addition-based isocyanate-based crosslinking agent CORONET L (trade name, manufactured by Nippon Polyurethane Co., Ltd.) and a photopolymerization initiator 4,4'-bis(diethylamino) were mixed with the obtained acrylic copolymer. 2 parts by mass of benzophenone were adjusted with ethyl acetate in order to adjust the viscosity to be easy to apply, and an adhesive composition was obtained.

[0129] On a separation plate of polyethylene terephthalate (PET) with a thickness of 25 μm, the adhesive composition is coated with a film thickness of 30 μm after drying, and after drying, it is pasted on a separation plate w...

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Abstract

Provided are an adhesive tape for protecting the surface of bump wafers and a method for manufacturing semiconductor wafers which are capable of preventing the damage of wafers, preventing seepages from generating, reducing peel strength, and suppressing a remaining part. The adhesive tape for protecting the surface is used for grinding the rear surface of the semiconductor wafers. An adhesive layer is included in a base film. The adhesive layer is a radiation curing adhesive layer. The thickness is thinner than the uneven surface of the semiconductor wafer. The variation of tackiness by the following formula (1) is 30% or greater. (1) [Tα-Tβ (air)] ÷ [Tα-Tβ (N2)] × 100 (Tα : measured tackiness value before irradiation, Tβ (air) : measured tackiness value after 500 mJ / cm^2 of irradiation in the air, Tβ (N2) : measured tackiness value after 500mJ / cm^2 of irradiation under a nitrogen atmosphere).

Description

【Technical field】 [0001] The present invention relates to an adhesive tape for protecting the surface of a semiconductor wafer and a method for manufacturing a semiconductor wafer using the adhesive tape. More specifically, the present invention relates to the following adhesive tape for protecting the surface of a semiconductor wafer and a method of manufacturing a semiconductor wafer using the adhesive tape. Contamination, the semiconductor wafer surface protection tape is used to protect the surface of the semiconductor wafer on which the integrated circuit is mounted. 【Background technique】 [0002] A semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the surface of the wafer by ion implantation, etching, etc., thereby manufacturing a semiconductor package. The semiconductor wafer is processed to a desired thickness by grinding, polishing, or the like on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02C09J7/02C09J133/08
CPCC09J7/20C09J2203/326H01L21/6836
Inventor 荒桥知未横井启时
Owner FURUKAWA ELECTRIC CO LTD