141results about How to "Won't seep" patented technology

The invention discloses a preparation method of a tungsten copper alloy. The preparation method comprises the steps that raw materials are subjected to spheroidizing through plasma, so that the raw materials turn to be spherical from polygonal, the dispersibility is greatly improved, the phenomenon of agglomeration of tungsten powder is reduced, evenly distribution of tungsten copper in the coppercladding process is guaranteed, therefore the surface of tungsten powder is sufficiently coated with copper, a solid phase hot pressing sintering method is adopted to prepare the tungsten copper alloy, in the solid phase hot pressing sintering process, rearrangement occurs when the power is subjected to short-time heat preservation at the temperature of 1100-1200 DEG C, the copper particles are separated from the surfaces of the tungsten particles and work together with the clad copper on the surface of the tungsten powder to improve the wettability of tungsten copper, so that the tungsten copper alloy is densificated in a short period, the tungsten copper alloy is cooled to be 1000-1050 DEG C at the speed of 2-5 DEG C/min, the copper fluidity is reduced, at the moment, the stress is applied so that the copper cannot be effused, and further densification of the tungsten copper alloy is facilitated. The obtained tungsten copper alloy has the fine grain size and uniform tissue due to the low sintering temperature and the short sintering time, meanwhile, the adopted preparation method is simple and convenient, the equipment is the commonly used equipment in the technical field, and therefore industrialized production is facilitated.