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Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article

A curing and shielding technology, applied in the direction of conductive adhesives, magnetic field/electric field shielding, chemical instruments and methods, etc., can solve the problems of reduced conductivity and inability to adapt to bending resistance, etc.

Active Publication Date: 2011-01-05
TOYO INK SC HOLD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electromagnetic wave shielding adhesive film using this base film cannot meet the stricter requirements for bending resistance
Furthermore, after bonding the electromagnetic wave shielding adhesive film to the adherend, if it is exposed to high temperature and high humidity, there will be a new problem that the conductivity will decrease.

Method used

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  • Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article
  • Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article
  • Curable electromagnetic shielding adhesive film, method for producing the same, use of the same, method for producing electromagnetic shielding article, and electromagnetic shielding article

Examples

Experimental program
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Effect test

Embodiment

[0297] Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. In Examples and Comparative Examples, "parts" and "%" mean "parts by weight" and "% by weight", respectively.

[0298] In addition, the weight-average molecular weight of the polyurethane polyurea resin and the number-average molecular weight of the polyester resin described in the examples are weight-average molecular weight and number-average molecular weight in terms of polystyrene obtained by GPC measurement, and the conditions for GPC measurement are as follows .

[0299] Device: Shodex GPC System-21 (manufactured by Showa Denko)

[0300] Chromatographic column: Shodex KF-802, KF-803L, KF-805L

[0301] (manufactured by Showa Denko) A total of 3 connections are used.

[0302] Solvent: THF

[0303] Flow rate: 1.0mL / min

[0304] Temperature: 40°C

[0305] Sample concentration: 0.3% by weight

[0306] Sample injecti...

Synthetic example 1

[0309] In a reaction vessel with a stirrer, thermometer, reflux condenser, dropping device and nitrogen introduction tube, the number average molecular weight obtained from adipic acid, terephthalic acid and 3-methyl-1,5-pentanediol was charged (hereinafter referred to as "Mn")=1006 diol 414 parts, dimethylol butyric acid 8 parts, isophorone diisocyanate 145 parts, and toluene 40 parts, reacted at 90 degreeC under nitrogen atmosphere for 3 hours. 300 parts of toluene was added thereto, and the solution of the polyurethane prepolymer which has an isocyanate group at the terminal was obtained. Next, to a mixture of 27 parts of isophoronediamine, 3 parts of di-n-butylamine, 342 parts of 2-propanol, and 576 parts of toluene, 816 parts of the solution of the obtained polyurethane prepolymer were added and reacted at 70°C. After 3 hours, a polyurethane polyurea resin solution having a weight average molecular weight (hereinafter referred to as "Mw") = 54,000 and an acid value of 5 m...

Synthetic example 2

[0311] In a reaction vessel with a stirrer, a thermometer, a reflux condenser, a dropping device and a nitrogen introduction tube, a mixture of adipic acid, 3-methyl-1,5-pentanediol and 1,6-hexane carbonate diol was charged. (1,6-ヘキサンカ-ボネ-トジオル) obtained 390 parts of diols with Mn=981, 16 parts of dimethylol butyric acid, 158 parts of isophorone diisocyanate and 40 parts of toluene, under a nitrogen atmosphere React at 90°C for 3 hours. 300 parts of toluene was added thereto, and the solution of the polyurethane prepolymer which has an isocyanate group at the terminal was obtained. Next, to a mixture of 29 parts of isophorone diamine, 3 parts of di-n-butylamine, 342 parts of 2-propanol, and 576 parts of toluene, 814 parts of the obtained polyurethane prepolymer solution were added and reacted at 70°C for 3 hours , to obtain a solution of polyurethane polyurea resin with Mw=43,000 and acid value of 10 mgKOH / g. 144 parts of toluene and 72 parts of 2-propanol were added thereto ...

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Abstract

Disclosed is a curable electromagnetic shielding adhesive film having a curable conductive polyurethane-polyurea adhesive layer (I) and a curable insulating polyurethane-polyurea resin composition layer (II). The curable conductive polyurethane-polyurea adhesive layer (I) contains a polyurethane-polyurea resin (A) which is obtained by reacting a urethane prepolymer (a4) having an isocyanate groupat an end with a polyamino compound (a5), and an epoxy resin (B) having two or more epoxy groups. The urethane prepolymer (a4) is obtained by reacting a carboxyl group-containing diol compound (a1), a polyol (a2) having a number average molecular weight of 500-8,000 which is not a carboxyl group-containing diol compound, and an organic diisocyanate (a3). The curable conductive polyurethane-polyurea adhesive layer (I) also contains 10-700 parts by weight of a conductive filler per 100 parts by weight of the total of the polyurethane-polyurea resin (A) and the epoxy resin (B). The curable insulating polyurethane-polyurea resin composition layer (II) contains a polyurethane-polyurea resin (C) which is obtained by reacting a urethane prepolymer (c4) having an isocyanate group at an end with apolyamino compound (c5), and an epoxy resin (D) having two or more epoxy groups. The urethane prepolymer (c4) is obtained by reacting a carboxyl group-containing diol compound (c1), a polyol (c2) having a number average molecular weight of 500-8,000 which is not a carboxyl group-containing diol compound, and an organic diisocyanate (c3).

Description

technical field [0001] The present invention relates to a curable electromagnetic wave shielding adhesive film, a method for producing the same, a method for using the same, a method for producing an electromagnetic wave shield, and an electromagnetic wave shield. Used to shield electromagnetic noise generated by electronic circuits on repeatedly bent flexible printed circuit boards, etc. Background technique [0002] Flexible printed circuit boards are bendable, and respond to the further performance and miniaturization requirements of OA equipment, communication equipment, mobile phones, etc. in recent years, and are often used to assemble electronic circuits into narrow and complex structures. With the miniaturization and high frequency of such electronic circuits, countermeasures against unnecessary electromagnetic noise generated thereby are becoming more and more important. In contrast, conventionally, an electromagnetic wave-shielding adhesive film for shielding elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B32B27/40B32B27/42C08G18/10C08G18/32C08G59/42C09J7/02C09J9/02C09J11/04C09J163/10C09J175/04
CPCC09J7/35C09J7/38C09J7/40C09J9/02C09J163/00C09J175/02C09J2203/00C09J2301/40C09J2301/408
Inventor 松泽孝洋小林英宣桑原章史西山祐司
Owner TOYO INK SC HOLD CO LTD
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