Tungsten copper alloy and preparation method thereof
A technology of tungsten-copper alloy and tungsten powder, which is applied in the field of tungsten-copper alloy and its preparation, can solve problems such as poor wettability, thermal conductivity and electrical conductivity reduction, achieve improved dispersion, simple process, and reduce the phenomenon of tungsten powder agglomeration Effect
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[0024] The invention provides a kind of preparation method of tungsten copper alloy, comprises the following steps:
[0025] (1) The induction plasma powder spheroidization device is used to perform plasma spheroidization treatment on pure tungsten powder and pure copper powder respectively to obtain spheroidized tungsten powder and spheroidized copper powder;
[0026] (2) Disperse the spheroidized tungsten powder obtained in step (1) into the copper plating solution, adjust the pH=11-14, heat to 50-85°C, keep stirring for 3-5 hours, filter, and dry to obtain copper-plated spheroidized Tungsten powder;
[0027] (3) Mix the spheroidized copper powder obtained in step (1) and the copper-plated spheroidized tungsten powder obtained in step (2) evenly, place it in a graphite mold, and then place it in a vacuum hot press. The heating rate of ℃ / min is raised to 1100-1200 ℃, and the temperature is kept for 15-30 minutes, and then the temperature is lowered to 1000-1050 ℃ with the co...
Embodiment 1
[0037] The parameters of the induction plasma powder spheroidization device are set as follows: the flow rate of the plasma generating gas is 30L / min, the protective layer gas is hydrogen, the flow rate is 80 L / min, the pressure of the synthesis chamber is 50kPa, the plasma power is 30kW, the powder delivery rate is 2kg / h, and the powder enters The location is in the middle of the high temperature zone, and the flow rate of powder feeding gas is 8 L / min.
[0038] Configure copper plating solution: Each liter of copper plating solution contains 10g copper sulfate, 20mL formaldehyde, 8mg sodium potassium tartrate, 10g 2,2’-bipyridyl, 60mL methanol, and the balance is water.
[0039] Prepare tungsten copper alloy by following steps:
[0040] (1) Using an induction plasma powder spheroidization device, plasma spheroidization treatment is performed on pure tungsten powder and pure copper powder with a purity of 99.8%, respectively, to obtain spheroidized tungsten powder and spheroi...
Embodiment 2
[0045] The parameters of the induction plasma powder spheroidization device are set as follows: the flow rate of the plasma generating gas is 60L / min, the protective layer gas is hydrogen, the flow rate is 400 L / min, the pressure of the synthesis chamber is 150kPa, the plasma power is 150kW, the powder delivery rate is 15kg / h, and the powder enters The location is in the middle of the high temperature zone, and the powder feeding gas flow rate is 20 L / min.
[0046] Configure copper plating solution: Each liter of copper plating solution contains 10g copper sulfate, 20mL formaldehyde, 8mg sodium potassium tartrate, 10g 2,2’-bipyridyl, 60mL methanol, and the balance is water.
[0047] Prepare tungsten copper alloy by following steps:
[0048] (1) Using an induction plasma powder spheroidization device, plasma spheroidization treatment is performed on pure tungsten powder and pure copper powder with a purity of 99.8%, respectively, to obtain spheroidized tungsten powder and spher...
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