Tungsten-copper alloy and production method thereof

A technology of tungsten-copper alloy and tungsten powder, applied in the field of tungsten-copper alloy and its preparation, can solve problems such as uneven structure, and achieve the effects of good structure uniformity, improved dispersion and simple preparation method

Active Publication Date: 2017-02-22
四川恒珲新材料科技有限公司
View PDF3 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is: the two-phase segregation of tungsten and copper in the tungsten-copper alloy prepared by the existing method leads to the problem of uneven structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tungsten-copper alloy and production method thereof
  • Tungsten-copper alloy and production method thereof
  • Tungsten-copper alloy and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0044] The invention provides a kind of preparation method of tungsten copper alloy, comprises the following steps:

[0045] a. Plasma spheroidization treatment of tungsten powder

[0046] The induction plasma powder spheroidization device is used to conduct plasma spheroidization treatment on tungsten powder to obtain spheroidized tungsten powder;

[0047] b. Electroless copper plating with spheroidized tungsten powder

[0048] Mix the spheroidized tungsten powder obtained in step a with the plating solution, adjust the pH value to 11-14, heat the water bath to 40-75°C, stir the mixed solution, and perform electroless copper plating; the composition of the plating solution includes: copper sulfate , formaldehyde, potassium sodium tartrate, 2,2'-bipyridyl and methanol;

[0049] c. Compression molding

[0050] The spheroidized tungsten powder after copper plating in step b is pre-pressed in a mold, and after isostatic pressing and repressing treatment, a blank is obtained; ...

Embodiment 1

[0078] Embodiment 1 Adopt the method of the present invention to prepare the tungsten-copper alloy with uniform structure

[0079] A kind of tungsten-copper alloy, its composition is: tungsten 90wt%, copper 10wt%, preparation process is as follows:

[0080] a. Plasma spheroidization treatment of tungsten powder

[0081] Take tungsten powder with a purity ≥ 99.95% and an average Fischer particle size of 8 microns, and use an induction plasma powder spheroidizer for spheroidization treatment;

[0082]

[0083] b. Electroless copper plating with ion spheroidized tungsten powder

[0084] The spherical tungsten powder obtained in step a is cleaned with acetone solution and ultrasonic waves, and the surface of the tungsten powder is roughened by dilute hydrofluoric acid aqueous solution, and the tungsten powder is sensitized and activated by colloidal palladium sensitization and activation solution;

[0085] The activated tungsten powder is mixed with the plating solution, heat...

Embodiment 2

[0095] Embodiment 2 Adopt the method of the present invention to prepare the tungsten-copper alloy with uniform structure

[0096] A tungsten-copper alloy, which is composed of: tungsten 70wt%, copper 30wt%, the preparation process is as follows:

[0097] a. Plasma spheroidization treatment of tungsten powder

[0098] Take tungsten powder with a purity ≥ 99.95% and an average Fischer particle size of 15 microns, and use an induction plasma powder spheroidizer for spheroidization treatment;

[0099]

[0100] b. Electroless copper plating with ion spheroidized tungsten powder

[0101] The spherical tungsten powder obtained in step a is cleaned with acetone solution and ultrasonic waves, and the surface of the tungsten powder is roughened by dilute hydrofluoric acid aqueous solution, and the tungsten powder is sensitized and activated by colloidal palladium sensitization and activation solution;

[0102] The activated tungsten powder is mixed with the plating solution, heate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
densityaaaaaaaaaa
densityaaaaaaaaaa
Login to view more

Abstract

The invention belongs to the field of alloy material production, and particularly relates to tungsten-copper alloy and a production method thereof. The tungsten-copper alloy and the production method thereof aim to solve the problem that alloy structures are not uniform because of two-phase segregation of tungsten and copper in tungsten-copper alloy produced through existing methods. According to the production method, after tungsten powder undergoes plasma spheroidization, copper powder serves as an inducer for chemical copper plating, then compression molding, pre-sintering and tungsten-copper infiltration are carried out, and finally the tungsten-copper alloy with uniform structures can be obtained. According to the method, the shape of the tungsten powder is changed into a spherical shape from a polygonal shape, the dispersity is improved, and uniform distribution of the tungsten and the copper in the chemical copper plating process is guaranteed. According to the produced alloy material, two-phase composition segregation of the tungsten and the copper can be effectively prevented, the thermal conductivity, the electrical conductivity, the arc ablation resistance, the high temperature performance, the plasticity and the machinability of the alloy material are greatly improved, and the alloy material can be widely applied to heat sink materials, encapsulating materials and high explosive anti-tank cartridge liner materials.

Description

technical field [0001] The invention belongs to the field of alloy material preparation, and in particular relates to a tungsten-copper alloy and a preparation method thereof. Background technique [0002] Tungsten copper has very good thermal conductivity, electrical conductivity, arc ablation resistance, high temperature performance, plasticity and processing technology, and is used as sweating material, electrical contact material, etc., because the alloy has a very similar thermal expansion coefficient to semiconductor silicon material It has become a widely used heat sink material and packaging material, because of its high density, high sound velocity and high plasticity, it is used as a shell material for armor-piercing ammunition. [0003] The melting point and thermal expansion coefficient of tungsten and copper are quite different, and the two metal elements are incompatible with each other. The composite material composed of W and Cu is a typical pseudoalloy. The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C22C27/04C22C1/04C23C18/16B22F1/02B22F3/04B22F3/10B22F3/24C23C10/22
CPCC22C1/045C22C27/04C23C10/22C23C18/1637C23C18/1646C23C18/405B22F3/04B22F3/10B22F3/24B22F1/14B22F1/17
Inventor 周钢柴淼
Owner 四川恒珲新材料科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products