Low viscosity and high thermal conductivity organosilicon gel and preparation method thereof

Abstract

Belonging to the technical field of thermal conductive interface materials, the invention relates to a low viscosity and high thermal conductivity organosilicon gel and a preparation method thereof. The low viscosity and high thermal conductivity organosilicon gel consists of a component A and a component B. Specifically, the component A comprises the following components: vinyl silicone oil, polyvinyl silicone oil, alkyl modified silicone oil, an active diluent, high thermal conductivity compound inorganic filler, a catalyst and pigment; and the component B comprises the following componentsby mass: vinyl silicone oil, polyvinyl silicone oil, alkyl modified silicone oil, an active diluent, high thermal conductivity compound inorganic filler, hydrogen-containing silicone oil, an inhibitorand a tackifier. The product provided by the invention has the characteristics of low viscosity, high extrudability and high thixotropy, and easy mixing, can be compressed into filling layers of different thicknesses and different shapes, can be quickly solidified into soft silicone gel at normal temperature and by heating, is suitable for filling the irregular gaps among various electronic devices and heat dissipators, and can play the role of heat conduction, insulation, buffering, shock absorption, etc.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting interface materials, and in particular relates to a low-viscosity, high-heat-conducting silicone gel and a preparation method thereof. Background technique [0002] Thermally conductive silicone gel is a thermally conductive interface material prepared from organosiloxane and thermally conductive fillers using a certain processing technology. It can realize automatic dispensing, fill gaps with complex shapes, solve the problem of heat transfer between heating components and radiators, and at the same time play the role of insulation, shock absorption and buffering. With the advent of the 5G era, the requirements for high power, miniaturization, and densification of electronic devices are higher, and the problem of heat dissipation of devices has become more prominent. Good heat dissipation is an important guarantee for the normal operation of electronic equipment. [0003] Currently widel...

AI Technical Summary

Problems solved by technology

However, high thermal conductivity not only leads to an increase in the cost of thermally conductive gel materials, but also higher and higher viscosity

High viscosity leads to uneven mixing of thermally conductive gels, making it difficult to fill small gaps, and cannot realize automatic dispensing, etc.

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