Low viscosity and high thermal conductivity organosilicon gel and preparation method thereof

A technology with high thermal conductivity and low viscosity, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of increased cost of thermally conductive gel materials, inability to realize automatic dispensing, difficulty in filling tiny gaps, etc., and achieve aging stability Good, low oil absorption value, the effect of reducing the amount of addition

Inactive Publication Date: 2019-10-15
GOLOHO TECH CHANGZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high thermal conductivity not only leads to an increase in the cost of thermally conductive gel materials, but also higher and higher viscosity

Method used

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  • Low viscosity and high thermal conductivity organosilicon gel and preparation method thereof
  • Low viscosity and high thermal conductivity organosilicon gel and preparation method thereof

Examples

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Example Embodiment

[0024] Example 1

[0025] A low-viscosity and high-thermal-conductivity silicone gel. The low-viscosity and high-thermal-conductivity silicone gel is composed of component A and component B, wherein component A includes the following components by mass: 100 parts of vinyl silicone oil, 5 parts of polyvinyl silicone oil, 5 parts of alkyl modified silicone oil, 5 parts of active diluent, 500 parts of high thermal conductivity compound inorganic filler, 1 part of catalyst and 2 parts of pigment, component B includes the following components by mass: 100 parts vinyl silicone oil, 5 parts polyvinyl silicone oil, 5 parts alkyl modified silicone oil, 5 parts active diluent, 500 parts high thermal conductivity compound inorganic filler, 1 part hydrogen-containing silicone oil, 0.5 part inhibitor, 0.5 part increase Adhesive. The vinyl silicone oil is vinyl terminated polydimethylsiloxane, the vinyl mass content is between 0.2%, and the viscosity is 30 mPa·s. The polyvinyl silicone oil i...

Example Embodiment

[0030] Example 2

[0031] A low-viscosity and high-thermal-conductivity silicone gel. The low-viscosity and high-thermal-conductivity silicone gel is composed of component A and component B, wherein component A includes the following components by mass: 100 parts of vinyl silicone oil, 20 parts of polyvinyl silicone oil, 20 parts of alkyl-modified silicone oil, 25 parts of active diluent, 2500 parts of high thermal conductivity compound inorganic filler, 10 parts of catalyst and 10 parts of pigment, component B includes the following components by mass: 100 parts vinyl silicone oil, 20 parts polyvinyl silicone oil, 20 parts alkyl modified silicone oil, 25 parts active diluent, 2500 parts high thermal conductivity compound inorganic filler, 20 parts hydrogen-containing silicone oil, 10 parts inhibitor, 10 parts increase Adhesive. The vinyl silicone oil is vinyl-terminated polydimethylsiloxane, polydimethyl-methylvinylsiloxane and polymethylphenyl-methylvinylsiloxane, and the viny...

Example Embodiment

[0036] Example 3

[0037] A low-viscosity and high-thermal-conductivity silicone gel. The low-viscosity and high-thermal-conductivity silicone gel is composed of component A and component B, wherein component A includes: 70g of vinyl-terminated polyethylene with a viscosity of 50 mPa·s Methylsiloxane, 30g of polydimethyl-methylvinylsiloxane with a viscosity of 250mPa·s vinyl-terminated, 5g of polyvinyl silicone oil with a viscosity of 500mPa·s, and the polyvinyl End and side chains contain vinyl polysiloxane, 20g alkyl-modified silicone oil, the alkyl-modified silicone oil is long-carbon chain alkyl grafted polydimethylsiloxane, 20g reactive diluent, the active The diluent is single-ended vinyl polysiloxane, 2300g of high thermal conductivity compound inorganic filler treated with long chain alkyl silane, oil absorption value is 4%, which contains 1900g spherical alumina (with a particle size of 100μm accounting for 5%, 70μm accounts for 10%, 30μm accounts for 80%, 1μm accounts ...

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Abstract

Belonging to the technical field of thermal conductive interface materials, the invention relates to a low viscosity and high thermal conductivity organosilicon gel and a preparation method thereof. The low viscosity and high thermal conductivity organosilicon gel consists of a component A and a component B. Specifically, the component A comprises the following components: vinyl silicone oil, polyvinyl silicone oil, alkyl modified silicone oil, an active diluent, high thermal conductivity compound inorganic filler, a catalyst and pigment; and the component B comprises the following componentsby mass: vinyl silicone oil, polyvinyl silicone oil, alkyl modified silicone oil, an active diluent, high thermal conductivity compound inorganic filler, hydrogen-containing silicone oil, an inhibitorand a tackifier. The product provided by the invention has the characteristics of low viscosity, high extrudability and high thixotropy, and easy mixing, can be compressed into filling layers of different thicknesses and different shapes, can be quickly solidified into soft silicone gel at normal temperature and by heating, is suitable for filling the irregular gaps among various electronic devices and heat dissipators, and can play the role of heat conduction, insulation, buffering, shock absorption, etc.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting interface materials, and in particular relates to a low-viscosity, high-heat-conducting silicone gel and a preparation method thereof. Background technique [0002] Thermally conductive silicone gel is a thermally conductive interface material prepared from organosiloxane and thermally conductive fillers using a certain processing technology. It can realize automatic dispensing, fill gaps with complex shapes, solve the problem of heat transfer between heating components and radiators, and at the same time play the role of insulation, shock absorption and buffering. With the advent of the 5G era, the requirements for high power, miniaturization, and densification of electronic devices are higher, and the problem of heat dissipation of devices has become more prominent. Good heat dissipation is an important guarantee for the normal operation of electronic equipment. [0003] Currently widel...

Claims

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Application Information

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IPC IPC(8): C09K5/08
CPCC09K5/08
Inventor 葛攀峰杜高来董俊祥石燕军唐志伟江莉莉
Owner GOLOHO TECH CHANGZHOU CO LTD
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