Graphene oxide modified compound type heat conducting silicone rubber and preparation method thereof

Abstract

The invention discloses graphene oxide modified compound type heat conducting silicone rubber and a preparation method thereof. According to the preparation method, the compound type silicon resin with high heat conduction property and low expansion factor is prepared by using 0.5-1 part of graphene oxide as heat conducting stuffing and an inorganic crosslinking agent, 10-50 parts of nanometer SiO2 as the heat conducting stuffing, 5-30 parts of compound of two MQ silicone resin containing hydroxyl and vinyl and different in viscosity as a special bonding modifying agent, 1-10 parts of organic hydrogen polysiloxane as an organic crosslinking agent, 0.1-2 parts of platinum complex as a catalyst, 0.01-0.001 part of alkynol substance as an inhibitor and 60-100 parts of polysiloxane resin as base rubber and adopting a nanometer compounding method, wherein the graphene oxide is partially modified by a silane coupling agent, and the nanometer SiO2 is prepared by a sol-gel method. The compound type silicon resin can be widely applied to encapsulation of various electronic components and plays a role in shock absorption and heat dissipation.

Description

technical field [0001] The invention relates to the technical field of silicone rubber, in particular to a graphene oxide modified composite heat-conducting silicone rubber and a preparation method thereof. Background technique [0002] With the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and multifunctional, and the assembly density of components is getting higher and higher. The heat dissipation of heating elements has become a prominent problem. If the accumulated heat cannot be dissipated in time, it will lead to an increase in the operating temperature of the components, which will directly affect the life and reliability of various high-precision equipment. In the packaging process of electronic components, in order to better reduce the thermal resistance during device assembly and improve the overall heat transfer capability, it is necessary to use a thermal interface material (TIM) between the heat tra...

AI Technical Summary

Problems solved by technology

Since the main body of high thermal conductivity silicone rubber is still silicone resin, its thermal expansion coefficient is large, which will cause greater pressure on various components of electronic components, resulting in deformation or damage of electronic components. Therefore, how to reduce the expansion coefficient is the key to high thermal conductivity. Another key issue facing silicone rubber

The thermal conductivity of AlN in commonly used high thermal conductivity fillers is very high, but the price is expensive, usually more than 1,000 yuan per kilogram; and after absorbing moisture, it will undergo hydrolysis reaction with water, and the Al(OH)3 produced will interrupt the thermal conduction path, and then Affects the transmission of phonons, so the thermal conductivity of the finished product is low. Even if the surface is treated with a silane coupling agent, it cannot guarantee that 100% of the filler surface is covered.

Using AlN alone can achieve high thermal conductivity, but the viscosity of the system rises sharply, which seriously limits the application field of the product

BN has a very high thermal conductivity and stable properties, but the price is very high. The market price ranges from several hundred yuan to thousands of yuan. Although BN alone can achieve high thermal conductivity, similar to AlN, the viscosity of the system increases sharply after a large amount of filling. , which severely limits the application field of the product

Spherical BN is produced abroad. The product has a large particle size, a small specific surface area, a high filling rate, and is not easy to increase viscosity, but the price is extremely high.

are therefore not suitable for industrial grade applications