Flexible substrate, manufacturing method thereof and display device

A flexible substrate, flexible substrate technology, applied in the direction of climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as damage, poor toughness, insulation layer fracture, etc., to achieve high reliability and good flexibility Effect

Active Publication Date: 2015-07-22
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned insulating layer is usually made of SiNx or SiOx material, which has poor toughness. Therefore, when the flexible display device is bent, the insulating layer is easily broken, so that the reliability of the thin film transistor and storage capacitor on the array substrate in the flexible display device is deteriorated or even Damage occurs, thus resulting in poor reliability of the display device

Method used

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  • Flexible substrate, manufacturing method thereof and display device
  • Flexible substrate, manufacturing method thereof and display device
  • Flexible substrate, manufacturing method thereof and display device

Examples

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] Such as figure 1 , figure 2 with image 3 As shown, a flexible substrate provided by an embodiment of the present invention includes:

[0036] flexible substrate 1;

[0037] A multi-layer insulating layer 8 formed on the flexible substrate 1; wherein,

[0038] A via hole is formed in at least one insulating layer, and the via hole is filled with organic material.

[0039] In the above-mentioned flexible substrate, in the structure of the multi-lay...

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PUM

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Abstract

The invention relates to the technical field of display and discloses a flexible substrate, a manufacturing method thereof and a display device comprising the flexible substrate. The flexible substrate comprises a flexible substrate body and a plurality of insulating layers formed on the flexible substrate body, and via holes are formed in at least one insulating layer and filled with organic materials. In the flexible substrate, the organic materials in the via holes of the insulating layers can absorb stress, the stress of the flexible substrate generated during bending can be reduced, the insulating layers are prevented from fracturing due to overlarge stress, and accordingly, the flexible substrate is high in reliability and good in bendability.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a flexible substrate, a manufacturing method thereof, and a display device containing the flexible substrate. Background technique [0002] A flexible display device is a display device formed based on a flexible base material. Since the flexible display device has the characteristics of rollability, wide viewing angle, and portability, the flexible display device has broad application prospects and good market potential in portable products and most display application fields. [0003] The array substrate of the flexible display device in the prior art usually uses an insulating layer, for example, an inorganic buffer layer, a gate insulating layer, an interlayer insulating layer, and a passivation layer. The above-mentioned insulating layer is usually made of SiNx or SiOx material, which has poor toughness. Therefore, when the flexible display device is bent, the insu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L27/32
CPCY02E10/549Y02P70/50H10K59/124H10K77/111H10K50/844H10K59/1201H10K2102/311H10K59/131H10K50/8445H10K59/122H10K59/1213H10K59/1216H10K71/00H01L27/1218H01L27/124H01L27/1248H01L27/1255
Inventor 蔡鹏
Owner BOE TECH GRP CO LTD
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