Notebook computer

A technology for notebook computers and electronic devices, applied in electrical digital data processing, instruments, digital data processing components, etc., can solve problems such as crash, poor heat dissipation, forced shutdown of graphics cards, etc., to improve heat dissipation problems and improve service life. Effect

Active Publication Date: 2014-01-22
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, most notebook computers have more and more functions, more and more heat generation, and the thickness is getting thinner and thinner, which leads to worse and worse heat dissipation effect.
For gamers or users who often use large-scale

Method used

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Examples

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Example Embodiment

[0029] The structure and principle of the present invention will be described in detail below with reference to the accompanying drawings. The examples cited are only used to explain the present invention and are not intended to limit the protection scope of the present invention.

[0030] Such as Figure 1 to Figure 6 As shown, a notebook computer includes a display portion 3 that can be flipped relative to a host portion and a host portion. The host portion includes an upper chassis 2 and a lower chassis 1, and the lower chassis 1 is provided with the host portion For accommodating space for electronic devices, the upper chassis 2 is covered on the lower chassis 1, and the host part further includes a connection for making the connection between the lower chassis 1 and the upper chassis 2 in a first state The changing connection structure between and the second state;

[0031] Wherein, in the first state, the lower surface of the upper chassis 2 is in contact with the upper surf...

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PUM

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Abstract

The invention relates to a notebook computer which comprises the host computer portion and a displayer portion capable of overturning relative to the host computer portion. The host computer portion comprises an upper base plate and a lower base plate, wherein the lower base plate is provided with an accommodating space for a host computer portion electronic device to be arranged, and an upper base plate cover is arranged on the lower base plate. The host computer portion further comprises a connection structure enabling the connection of the lower base plate and the upper base plate to be switched in a first state and a second state. In the first state, the lower surface of the upper base plate is in contact with the upper surface of the lower base plate. In the second state, a distance is reserved between the lower surface of the upper base plate and the upper surface of the lower base plate to form a heat dissipation space. The notebook computer has the advantages that on the premise that the thickness of the notebook computer is not changed, the heat dissipation problem of the notebook computer is effectively solved, and the service life of the notebook computer is prolonged.

Description

technical field [0001] The invention relates to the field of computer terminal design, in particular to a notebook computer which is good for heat dissipation. Background technique [0002] At present, most notebook computers have more and more functions, more and more heat generation, and the thickness is getting thinner and thinner, which leads to worse and worse cooling effect. For gamers or users who often use large-scale software, running large-scale software often forces the computer fan speed to increase due to overheating; overheating of the graphics card causes forced shutdown, crash and other situations. Seriously affect the quality of life, and reduce the life of the notebook computer. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a notebook computer, which can effectively improve the heat dissipation problem of the notebook computer and increase the service life of the notebook computer. [0...

Claims

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Application Information

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IPC IPC(8): G06F1/16G06F1/20
Inventor 黄维
Owner BOE TECH GRP CO LTD
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