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Electrostatic protection method and structure for under-board type microphone

A technology of electrostatic protection and microphone, applied in the direction of electrical components, etc., can solve problems such as damage to the chip, and achieve the effect of preventing damage to the chip and prolonging the service life.

Inactive Publication Date: 2017-08-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide an electrostatic protection method and structure of an under-board microphone, which aims to solve the problem that in the prior art, the common under-board microphone exists, and external static electricity easily enters the microphone through the sound inlet hole on the PCB. Defects that damage the chip

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  • Electrostatic protection method and structure for under-board type microphone
  • Electrostatic protection method and structure for under-board type microphone

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Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0020] like Figure 1~2 Shown is a preferred embodiment provided by the present invention.

[0021] This embodiment proposes an electrostatic protection method for an under-board microphone. The electrostatic protection method is applied to a mobile phone with an under-board microphone, and its purpose is to prevent static electricity from entering the microphone and damaging the chip.

[0022] The mobile phone has an electronic component and a casing 1 covering the ele...

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Abstract

The invention relates to the technical field of electrostatic protection, and discloses an electrostatic protection method and structure of an under-board microphone, which is applied to a mobile phone with a built-in under-board microphone. The through hole that penetrates to the outside of the mobile phone, the inside of the mobile phone is provided with a PCB board, the PCB board is provided with a sound inlet hole connecting the microphone and the through hole, and the edge of one end of the sound inlet hole passes through the SMT (Surface mount technology) A gasket electrically connected to the PCB board is installed and pasted. The present invention realizes the complete grounding of the sound inlet hole by using an SMT mounting gasket at the position of the sound inlet hole on the PCB board, so that the outside of the mobile phone Before entering the microphone, the static electricity is introduced to the PCB board through the gasket to achieve grounding, thereby preventing external static electricity from entering the microphone and damaging the chip, and prolonging its service life.

Description

technical field [0001] The invention relates to the technical field of electrostatic protection, in particular to an electrostatic protection method and structure of an under-board microphone. Background technique [0002] Silicon MICs (microphones) are commonly used in mobile phones, while under-board silicon MICs are used relatively more. Usually, the sound inlet holes of the under-board silicon MIC are set under the device body, which leads to the fact that after the silicon MIC is soldered on the PCB, it is often necessary to drill mechanical holes on the PCB for sound output. The sound inlet is not grounded, so that the static electricity outside the mobile phone can enter the MIC body through the sound inlet, and damage the chip; for the board-type silicon MIC, the sound inlet is set on the silicon MIC. On the shell, since the shell is grounded, there is no problem of static electricity entering the silicon MIC body and damaging the internal chip. [0003] At present...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R29/00
Inventor 谢荣兵
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD