Electronic component mounting system and electronic component mounting method

Abstract

The present invention provides an electronic component mounting system and an electronic component mounting method capable of mounting shielding components with accurate height dimensions and sufficient bonding strength. An inspection process is provided, after the electronic component (21) is mounted on the first solder part (S1) for electronic component bonding and before the shielding component (22) is mounted on the second solder part (S2) for shielding component bonding, the inspection The area (23) where the wall portion of the mounted shielding element (22) is located is free of foreign matter, and the substrate ( 3) The area (23) is coated with solder to form the additional solder portion (SA) and then the shielding element (22) is mounted to set the work process. As a result, soldering is prevented from being performed in a state where foreign objects are interposed and an inappropriate amount of solder is used, and the shielding element ( 22 ) can be mounted with an accurate height dimension and sufficient bonding strength.

Description

technical field [0001] The present invention relates to an electronic component mounting system and an electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate. Background technique [0002] An electronic component mounting system that mounts electronic components on a substrate to manufacture a mounted substrate is mainly composed of an electronic component mounting line that connects a plurality of component mounting equipment such as a solder printing device and an electronic component mounting device. The substrate is conveyed from the upstream side to the downstream side on the electronic component mounting line, and components mounting operations such as solder printing and component mounting are performed sequentially on the substrate. Here, when electromagnetic shielding is required on a mounting substrate to be produced, a shielding element is mounted on the mounting surface of the substrate so as...

AI Technical Summary

Problems solved by technology

Such a gap occurs when the shielding element is mounted with a foreign object such as a dropped component remaining on the shielding electrode. If the solder joint is completed with the gap generated, the height of the shielding element cannot match the mounting surface of the completed substrate. The specified dimensions are the same, and there is a problem that interference with other parts occurs when the substrate is mounted on the case

Therefore, such troubles are increasing in frequency with the size reduction and thinning of electronic devices such as mobile devices, and effective countermeasures are required.

In addition, the solder supplied to the shielding electrode by screen printing cannot always ensure an appropriate amount due to printing deviations, etc., and there is a problem that a sound solder joint cannot be formed at the site where "flash" occurs in the screen printing. Situations that result in insufficient joint strength

Images