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Skirt removal method, case processing method, case and electronic device

A skirt and thin-plate metal technology, applied in the field of casings and electronic devices, can solve the problem of inaccurate dimensions of finished metal casings, and achieve the effect of accurate dimensions and accurate height dimensions

Active Publication Date: 2017-11-21
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of skirt removal often has large tolerances in the reference plane due to shell deformation, resulting in inaccurate dimensions of the finished metal shell
Furthermore, in the current process of stamping and forming metal shells by sheet metal, when the above method of removing the skirt is used for thinner metal shells, the above problems are more likely to occur

Method used

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  • Skirt removal method, case processing method, case and electronic device
  • Skirt removal method, case processing method, case and electronic device
  • Skirt removal method, case processing method, case and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] refer to figure 1 and figure 2 , the present embodiment provides a method for removing the skirt of a sheet metal shell. The method for removing the skirt of the sheet metal shell comprises the following steps:

[0033] S1, using a vacuum adsorption device 1 to adsorb the surface of the thin-plate metal shell 2 opposite to the skirt 3;

[0034] S2. Using a CNC machine tool 4 to remove the skirt 3 .

[0035] Thus, the thin-plate metal shell 2 is fixed by means of vacuum adsorption. For the thin-plate metal shell 2 with weak strength, the vacuum adsorption can absorb and smooth the entire surface opposite to the skirt 3, and take the smooth adsorption surface 6 as a reference. Processing the skirt 3 can ensure that the size of the sheet metal shell 2 is accurate.

[0036] Further, in this embodiment, the vacuum adsorption device 1 is located below the thin-plate metal shell 2 , the thin-plate metal shell 2 is the metal shell of the electronic device, and the metal sh...

Embodiment 2

[0048] refer to Figure 6 , In this embodiment, a casing processing method is provided. The shell processing method comprises the steps of:

[0049] Step 1, forming a thin-plate metal shell 2 by using a metal sheet, and the thin-plate metal shell 2 includes a skirt 3;

[0050] Step 2, performing in-mold injection molding on the thin-plate metal shell 2, forming a plastic part connected to the thin-plate metal shell 2;

[0051] Step 3: Remove the skirt 3 by using the method for removing the skirt of the sheet metal shell in Embodiment 1 to form a shell.

[0052] Of course, the shell formed in step 3 is not the final product. The shell formed in step 3 needs post-processing including oxidation, sandblasting, highlighting, and protective film to enhance the appearance and functionality of the metal shell. And during the processing, it can be polished, de-sharpened and cleaned at any time according to the needs.

[0053] Preferably, the casing is a casing of an electronic devi...

Embodiment 3

[0055] In this embodiment, a housing is provided, which is manufactured by the housing processing method in Embodiment 2, and has an accurate height dimension. Preferably, the casing is a casing of an electronic device, and the electronic device is an electronic mobile device such as a mobile phone, a tablet computer, a learning machine, a game machine, or the like. More preferably, the above casing is a mobile phone casing.

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PUM

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Abstract

The invention relates to the field of electronic device parts and machining methods thereof, in particular to a skirt removal method, a shell body machining method, a shell body and an electronic device. According to the skirt removal method, a vacuum suction device is adopted for sucking the surface, opposite to the skirt, of a sheet metal shell; and a numerically-controlled machine tool is adopted for removing the skirt. According to the shell body machining method, sheet metal is adopted for forming the sheet metal shell; intromode injection molding is carried out on the sheet metal shell to form a plastic part connected with the sheet metal shell; and the skirt is removed by adopting the skirt removal method for the sheet metal shell. Because the sheet metal shell is fixed through vacuum suction, the whole surface, opposite to the skirt, of the sheet metal shell low in strength can be sucked to be flat, and by using the flat sucked surface as the basis for skirt machining, it can be guaranteed that the size of the sheet metal shell is accurate, in other words, it is guaranteed that the height dimension of the shell body is accurate. The shell body is machined by adopting the shell body machining method, the electronic device comprises the shell body, and the height dimension of the shell body and the height dimension of the electronic device are accurate.

Description

technical field [0001] The invention relates to the field of electronic device parts and processing methods thereof, in particular to a method for removing the skirt of a thin-plate metal shell, a shell processing method, the shell and an electronic device. Background technique [0002] In order to ensure the precise height and size of the metal shell and facilitate assembly, the height of the metal shell will be higher than the actual product size by a certain margin, and the higher part is the skirt. For example, in the shell processing process, before injection molding, the metal shell includes a skirt, and after injection molding, the skirt is removed by a numerical control machine tool (CNC) to ensure that the size of the metal shell is accurate, that is, to ensure the shape of the shell True to size. For the current thicker metal shell, when processing the skirt edge positioning, use four points on the four corners of the product inner cavity, take the average height ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14B23C3/12H05K5/04
CPCB23C3/12B29C45/14B29C45/1418B29C2045/14237H05K5/04
Inventor 许海平
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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