Electronic element installation system and electronic element installation method

Abstract

The invention provides an electronic element installation system and an electronic element installation method, capable of installing shielding elements with accurate height and sufficient bonding strength. The method includes a detection setting step. After an electronic element (21) is embarked on a first solder tin portion (S1) for joint of the electronic element and before a shielding element (22) is embarked on a second solder tin portion (S2), the wall portion of the shielding element (22) is detected to see the existence of impurities, and before a second electronic element of the shielding element (22) is embarked, the shielding element (22) is embarked an impurity-free area (23) of a substrate is coated with tin to form an additional solder tin portion (SA). The working step is set in such a manner. In this way, tin soldering joint may not carry out when impurities are present and the tin soldering amount is not appropriate. The shielding element (22) can be installed with accurate height and sufficient bonding strength.

Description

technical field [0001] The present invention relates to an electronic component mounting system and an electronic component mounting method for manufacturing a mounting substrate by mounting an electronic component on a substrate. Background technique [0002] An electronic component mounting system that mounts electronic components on a substrate to manufacture a mounted substrate is mainly composed of an electronic component mounting line that connects a plurality of component mounting equipment such as a solder printing device and an electronic component mounting device. The substrate is conveyed from the upstream side to the downstream side on the electronic component mounting line, and components mounting operations such as solder printing and component mounting are performed sequentially on the substrate. Here, when electromagnetic shielding is required on a mounting substrate to be produced, a shielding element is mounted on the mounting surface of the substrate so as...

AI Technical Summary

Problems solved by technology

Such a gap occurs when the shielding element is mounted with a foreign object such as a dropped component remaining on the shielding electrode. If the solder joint is completed with the gap generated, the height of the shielding element cannot match the mounting surface of the completed substrate. The specified dimensions are the same, and there is a problem that interference with other parts occurs when the substrate is mounted on the case

Therefore, such troubles are increasing in frequency with the size reduction and thinning of electronic devices such as mobile devices, and effective countermeasures are required.

In addition, the solder supplied to the shielding electrode by screen printing cannot always ensure an appropriate amount due to printing deviations, etc., and there is a problem that a sound solder joint cannot be formed at the site where "flash" occurs in the screen printing. Situations that result in insufficient joint strength

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