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Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

A technology of metal paste and metal particles, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve long-term reliability decline, lower pass rate, semiconductor components, bonding materials and support member cracks And other issues

Active Publication Date: 2019-11-15
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, when the residual thermal stress between the semiconductor element and the supporting member is large, characteristic changes due to thermal deformation will occur in the semiconductor element, and damage such as cracks will occur in the semiconductor element, bonding material, and supporting member
Therefore, the residual thermal stress between the semiconductor element and the supporting member becomes a cause of lower yield and lower long-term reliability

Method used

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  • Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
  • Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
  • Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device

Examples

Experimental program
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Effect test

preparation example Construction

[0112]

[0113] The metal paste for joining can be prepared by mixing the aforementioned submicron copper particles, monocarboxylic acid having 1 to 9 carbon atoms, micron copper particles, other metal particles, additives and solvent components as needed. After mixing the components, a stirring treatment may be performed. The metal paste for joining can be classified to adjust the maximum particle size of the dispersion. In this case, the maximum particle diameter of the dispersion liquid may be 20 μm or less, and may be 10 μm or less.

[0114]When adding components other than submicron copper particles and monocarboxylic acids with carbon numbers of 1 to 9 (such as micron copper particles, other metal particles, additives, and solvent components), the metal paste for bonding can be prepared by pre-blending the submicron copper particles , the solvent component and the carboxylic acid (such as long-chain alkyl carboxylic acid) with carbon number of 10 or more used accordin...

Embodiment 1

[0180]

[0181] Put 0.77g of α-terpineol, 0.33g of tributyrin, 0.0022g of acetic acid, 6.23g of CH-0200, and 2.67g of 2L3N / A into an agate mortar and knead until the dry powder disappears. The mixed solution was transferred to a plastic bottle (container made of polyethylene). Use a rotation-revolution type stirring device (Planetary Vacuum Mixer ARV-310, manufactured by Thinky Co., Ltd.) for 2000 min -1 (2000 rev / min) to the plastic bottle behind the seal plug and stir 2 minutes. Thereafter, 0.018 g of the obtained mixed solution and zinc particles (product model: 13789, manufactured by Alfa Aesar) were put into an agate mortar, kneaded until the dry powder disappeared, and the mixed solution was transferred to a plastic bottle. Use a rotation-revolution type stirring device (Planetary Vacuum Mixer ARV-310, manufactured by Thinky Co., Ltd.) for 2000 min -1 (2000 rev / min) to the plastic bottle behind the seal plug and stir 2 minutes. The obtained paste-like mixed solution...

Embodiment 2 and 3、 and comparative example 1～3

[0186] Make the usage amount of α-terpineol, tributyrin, acetic acid, CH-0200, 2L3N / A and zinc particles into the values ​​shown in Table 1 and Table 2, and operate in the same manner as in Example 1 except that A paste-like mixed solution was prepared to obtain a metal paste for joining. Next, except that the metal paste for joining prepared above was used instead of the metal paste 1 for joining, it carried out similarly to Example 1, and the joined body of Examples 2 and 3, and Comparative Examples 1-3 were manufactured.

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Abstract

Provided is a metal paste for joints which contains metal particles and a C1-9 monovalent carboxylic acid, and in which the metal particles include submicrometer copper particles having a volume meandiameter of 0.12-0.8 [mu]m, and the content of the C1-9 monovalent carboxylic acid is 0.015-0.2 parts by mass per 100 parts by mass of the metal particles.

Description

technical field [0001] The present invention relates to a metal paste for bonding, a bonded body, and a manufacturing method thereof, and a semiconductor device, and a manufacturing method thereof. Background technique [0002] When manufacturing a semiconductor device, various bonding materials are used to bond a semiconductor element to a lead frame or the like (support member). In semiconductor devices, especially in the bonding of power semiconductors and LSIs that operate at high temperatures of 150° C. or higher, high-melting-point lead solder has been used as a bonding material. In recent years, due to the increase in capacity and space saving of semiconductor elements, the operating temperature has increased to around the melting point of high-melting lead solder, making it difficult to ensure connection reliability. On the other hand, with the strengthening of RoHS regulations, lead-free bonding materials are required. [0003] Joining of semiconductor elements us...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/00H01L21/52B22F1/05B22F1/052B22F1/068B22F1/10
CPCH01L2224/92247H01L2924/181H01L2224/32245H01L2224/40245H01L2224/48091H01L2224/48247H01L2224/73265B23K35/025B23K35/302B23K35/3618B22F7/064B22F2999/00H01L21/56H01L23/3107H01L2224/40491B22F1/052B22F1/068B22F1/10B22F1/05H01L2224/73221H01L2924/00012H01L2924/00014B22F3/22H01L2924/00H01L24/28H01L21/52H01L24/27H01L23/492C09J1/00H01L2021/60007B23K2101/40B22F2301/10B22F2304/058H01L23/3121H01L23/49562H01L23/49582H01L24/48H01L2224/48175B22F3/10B23K1/0008B23K1/20
Inventor 川名祐贵中子伟夫根岸征央石川大须镰千绘江尻芳则
Owner RESONAC CORP
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