High-frequency module

Abstract

The invention provides a system for distributing resources as required in an adaptively way in a virtual world, which comprises a dynamic sensing request distributing module, 1-PM:N-VM module and a data center overall management module. The 1-PM:N-VM module distributes resources on a physical machine according to user experiences collected on a real-time basis. The dynamic sensing request distributing module distributes loads to suitable virtual machines according to monitored application request load information and capacity information of the virtual machines so as to respond to the requests. The data center overall management module determines whether the virtual machines are to be transferred among the physical machines so as to rearrange the machine according to the collected resource load information of the physical machine. When the number of the physical machines is excessive or insufficient, the data center overall management module further determines whether to release or apply new physical machines from a spare resource pool so as to retreat or enter application services. The method for distributing resources as required in an adaptive way in a virtual world comprises an adaptive virtual machine dynamic capacity sensing request distributing strategy, a 1-PM:N-VM resource distributing strategy and a virtual machine transfer strategy. The invention has an application prospect in the computer technology field.

Description

technical field [0001] The present invention relates to a high-frequency module having a structure in which a coaxial connector is mounted on the outer surface of a housing for accommodating an insulating substrate. Background technique [0002] Conventionally, for high-frequency modules such as TV tuners (hereinafter referred to as TV tuners), there is known a prior art in which a coaxial connector is mounted on the front surface of a housing (for example, refer to Patent Document 1). In particular, in this prior art, the area of ​​the circuit board is enlarged by eliminating the interference between the mounting portion inside the housing and the circuit board, thereby reducing the size of the entire circuit board. In addition, by securing the maximum area of ​​the circuit board inside the housing, it is possible to increase the density of wiring patterns and the like accordingly. [0003] In the above-mentioned prior art (Patent Document 1), since the joint surface with ...

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Problems solved by technology

[0007] However, when drawing is used as in the above-mentioned prior art (Patent Document 2), the thickness dimension of the frame can only be reduced within the allowable range that the metal plate can be expanded by drawing, and the overall thinness of the module remains the same. There are technical limits

Even so, if the thickness dimension of the frame is simply reduced to exceed the processing limit, the area on the front surface of the frame where the coaxial connector can be soldered is reduced, so the joining of the coaxial connector cannot be avoided. The strength is greatly reduced

[0008] In addition, in the prior art (Patent Document 2), although the flange portion of the coaxial connector is caulked over the entire circumference inside the frame, if the thickness dimension of the frame is reduced, it can be done. The range of chiseling operations is reduced accordingly

In this case, it becomes difficult to perform caulking on the entire circumference, so there is a problem that the bonding strength also decreases accordingly.

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