Ultrasonic wave fusion jointing method for speaker case

A bonding method and speaker technology, applied in the direction of sensors, electrical components, etc., can solve the problems of complex shape of the joint and inability to completely eliminate the deviation of the contact point, etc., and achieve the effects of easy adjustment, beautiful appearance and low cost
CN101150887BInactive Publication Date: 2011-06-22FENGDA ELECTRIC MACHINERY HONG KONG
3 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
FENGDA ELECTRIC MACHINERY HONG KONG
Publication Date
2011-06-22
Estimated Expiration
Not applicable Β· inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The present invention relates to a loudspeaker case ultrasonic deposition joining method, forming steps at the peripheral wall of a pair of case sheets (1), (2) of cutting mechanism composed of same thermoplastic resin thereby forming intermeshably embedded joining part, and forming projecting shape rib whose section is right-angle-triangle projecting from at least one joining end surface of the case sheets playing as said energy guiding piece function, applying ultrasonic vibrating energy and pushing-pressing force, to melt the projecting shape rib, depositing the joining part and joining each case sheet to integral. Using the present invention, when using ultrasonic deposition joining two each case sheet of case made from resin with two-divided mechanism and making, can prevent asymmetric deposition, deposition quantity deficiency, strength deficiency from generating, or prevent air leakage and airtight damage from generating, prevent melting resin more, the residual resin overflowing leading bad appearance.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a speaker case, and more particularly, to a bonding method using ultrasonic welding technology for a resin speaker case suitable for mounting on a thin electronic device such as a notebook personal computer. Background technique

[0002] In recent years, the portability of various electronic devices has been rapidly developing, especially for mobile phones and notebook personal computers, and it is important to be able to carry them anywhere and use them freely at any time regardless of the location. Therefore, miniaturization, thinning, and weight reduction of equipment are particularly required, and it has become mainstream to replace heavy metal housings with lighter resin housings. Accordingly, a resin case is also used for a speaker case mounted on such an electronic device. The method of assembling this kind of resin case is to divide and mold the case up and down into a pair of case pieces, and after mounting pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More