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Ultrasonic wave fusion jointing method for speaker case

A bonding method and speaker technology, applied in the direction of sensors, electrical components, etc., can solve the problems of complex shape of the joint and inability to completely eliminate the deviation of the contact point, etc., and achieve the effects of easy adjustment, beautiful appearance and low cost

Inactive Publication Date: 2011-06-22
FENGDA ELECTRIC MACHINERY HONG KONG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the shape of the joint part is complex, and the relative relationship between the tip of the joint part and the tapered surface is roughly the same as that of the conventional energy guide with a roughly isosceles triangular cross-section, and the problem of deviation of the initial contact point cannot be completely eliminated.

Method used

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  • Ultrasonic wave fusion jointing method for speaker case
  • Ultrasonic wave fusion jointing method for speaker case
  • Ultrasonic wave fusion jointing method for speaker case

Examples

Experimental program
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Embodiment 1

[0035] figure 1 It is a conceptual diagram showing the overall structure of the ultrasonic welding bonding of the resin speaker cabinet of the present invention.

[0036] 1 and 2 in the figure are a pair of bisected casing pieces formed in advance in a disc or box shape from the same resin material based on a thermoplastic resin such as polypropylene. Concavo-convex steps for coupling are provided on the lower end and upper end of the respective outer peripheral walls, and the speaker housing having a sealed acoustic space inside is formed by engaging the respective end faces with each other. First, after a predetermined component (not shown) is attached to one of the casing pieces 2, it is placed in the recess of the fixed base 6, and the other casing piece 1 is covered thereon as a cover. The pressing block 7 is brought into contact with the surface of the casing sheet 1, and a predetermined vibration energy and pressing force from an unillustrated ultrasonic welding machi...

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PUM

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Abstract

The present invention relates to a loudspeaker case ultrasonic deposition joining method, forming steps at the peripheral wall of a pair of case sheets (1), (2) of cutting mechanism composed of same thermoplastic resin thereby forming intermeshably embedded joining part, and forming projecting shape rib whose section is right-angle-triangle projecting from at least one joining end surface of the case sheets playing as said energy guiding piece function, applying ultrasonic vibrating energy and pushing-pressing force, to melt the projecting shape rib, depositing the joining part and joining each case sheet to integral. Using the present invention, when using ultrasonic deposition joining two each case sheet of case made from resin with two-divided mechanism and making, can prevent asymmetric deposition, deposition quantity deficiency, strength deficiency from generating, or prevent air leakage and airtight damage from generating, prevent melting resin more, the residual resin overflowing leading bad appearance.

Description

technical field [0001] The present invention relates to a speaker case, and more particularly, to a bonding method using ultrasonic welding technology for a resin speaker case suitable for mounting on a thin electronic device such as a notebook personal computer. Background technique [0002] In recent years, the portability of various electronic devices has been rapidly developing, especially for mobile phones and notebook personal computers, and it is important to be able to carry them anywhere and use them freely at any time regardless of the location. Therefore, miniaturization, thinning, and weight reduction of equipment are particularly required, and it has become mainstream to replace heavy metal housings with lighter resin housings. Accordingly, a resin case is also used for a speaker case mounted on such an electronic device. The method of assembling this kind of resin case is to divide and mold the case up and down into a pair of case pieces, and after mounting pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R31/00
CPCB29C66/322B29C66/30223B29C66/8322B29C65/08B29C66/54B29C66/1282B29C66/12841B29C66/71B29C66/73921B29K2023/12
Inventor 刘德浩
Owner FENGDA ELECTRIC MACHINERY HONG KONG
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