Stack structure for enhancing bonding strength of touch panel

Abstract

The invention discloses a touch panel, comprising: a touch substrate, a mirror substrate, a reflection layer and a liquid bonding layer. Wherein, the touch substrate has a bonding area, and an electrical component is arranged in the bonding area; the mirror substrate has a first peripheral area, and the first peripheral area corresponds to the bonding area, and is formed in the first peripheral area. There is a first shielding layer; the reflective layer is formed on the first shielding layer at a position relative to the electrical component; and the liquid adhesive layer is distributed and formed between the electrical component and the reflective layer, after reflection After the layer is irradiated with light, the liquid adhesive layer will be solidified, further enabling the mirror substrate and the touch substrate to achieve sufficient bonding strength.

Description

technical field [0001] The present invention relates to a stacking structure, in particular to a stacking structure for strengthening joint strength. Background technique [0002] Touch displays are gradually being widely used in various electronic devices, such as portable or handheld electronic devices. The touch display is an application technology that combines touch technology (such as resistive and capacitive touch technology) with a display. Due to the mature development of liquid crystal display (LCD) technology in recent years, it has become a trend to combine the touch technology with the liquid crystal display. [0003] In the touch display, in addition to the above-mentioned liquid crystal display, a touch panel is required to form a so-called touch display. A common touch panel includes a supporting substrate for supporting sensing electrodes and a protective substrate for providing anti-scratch, anti-glare or anti-reflection functions. When manufacturing th...

AI Technical Summary

Problems solved by technology

In the actual bonding work, due to the shielding material on the protective substrate, the liquid adhesive cannot be cured by irradiating the front of the protective substrate; if the liquid adhesive is irradiated from the back of the supporting substrate, it cannot be cured due to the shielding of the conductive circuit and the flexible circuit board. to solidify

Therefore, when the above-mentioned liquid glue is used for bonding, since part of the liquid glue cannot be cured, it will not only reduce the bonding strength between the supporting substrate and the protective substrate, but also the acidic substance in the liquid glue will corrode the above-mentioned touch components.

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