Die ejector device

Abstract

The invention discloses a die ejector device, and relates to the field of pushing-out equipment. The die ejector device is not prone to being damaged, can prevent materials from being damaged due to the fact that the materials collide with a stamping die, and is long in service life and high in practicality. The die ejector device comprises a sleeve, an ejector column and a limiting block. The ejector column and the sleeve are matched in an up-and-down sliding mode. A first spring is arranged in the sleeve. The die ejector device further comprises an upper ejector plate, a buffer plate and a connecting column. The buffer plate is located above the ejector column. The upper ejector plate is located above the buffer plate. A fixing groove is formed in the top end of the upper ejector plate. At least one second spring and at least one pressure block are arranged in the fixing groove. The top end of the connecting column is fixedly connected with the upper ejector plate. An insertion hole is formed in the position, corresponding to the connecting column, of the buffer plate. The connecting column penetrates through the insertion hole. A third spring is arranged between the upper ejector plate and the buffer plate. The connecting column is sleeved with the third spring, and a vent hole is formed in the bottom of the sleeve.

Description

technical field [0001] The invention relates to the technical field of material ejection, in particular to a mold ejection device. Background technique [0002] As we all know, the mold ejector device is a kind of equipment used to eject the material on the stamping die, which is widely used in the field of industrial production; There is a spring in the barrel; the mold ejector is generally used in conjunction with the stamping die. The stamping die includes an upper die set and a lower die set. The die ejector is generally installed on the lower die set. Bottom dead point and press the mold ejector device. After the stamping is completed, the upper die set goes up, and the die ejector device ejects the material from the lower die set. [0003] The existing mold ejecting device, when working, the upper mold group of the stamping die directly impacts the mold ejecting device, because the spring strength inside the sleeve is limited, and the mold ejecting device itself is re...

AI Technical Summary

Problems solved by technology

[0003] The existing mold ejecting device, when working, the upper mold group of the stamping die directly impacts the mold ejecting device, because the spring strength inside the sleeve is limited, and the mold ejecting device itself is relatively fragile, so the mold ejecting device is easily damaged damage

At the same time, some materials will collide with the stamping die after being ejected, resulting in damage to the materials

In addition, the upper end of the ejector column of the existing mold ejector device is fixed, so the ejector device may not adapt to the shape of the material, and when the ejector column is damaged, the mold ejector device needs to be replaced as a whole, which reduces the cost of the device. Practicality and service life

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