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Semiconductor support

A semiconductor and bracket fixing technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of high LED cost and few LED chip placement, and achieve the effect of reducing LED cost and bracket cost

Inactive Publication Date: 2014-04-16
邹志峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention proposes a semiconductor support in order to solve the problems of fewer LED chip placement positions and high LED cost in the existing in-line LED support. The technical solution adopted in the present invention is:

Method used

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  • Semiconductor support
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Embodiment Construction

[0020] This embodiment is a preferred implementation mode of the present invention, and all others whose principle and basic structure are the same or similar to this embodiment are within the protection scope of the present invention.

[0021] refer to figure 1 , figure 2 and image 3 As shown in , a semiconductor support includes a support made of metal. The support is divided into an upper support 1, a middle support 2 and a lower support 3. The lower support 3 is below the upper support 1, and the middle support 2 is located between the upper support 1 and the lower support. Between the brackets 3, the middle bracket 2 includes two crossbeams 5 (the two longest strip-shaped beams 5 in the left and right directions in the middle bracket 2); the upper bracket is provided with a plurality of upper monomers; each of the The upper unit includes 1 upper chip pin 11 and 1 upper conductive pin 12, the upper chip pin 11 is located on the right side of the upper conductive pin 12...

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Abstract

The invention provides a semiconductor support, and relates to the technical field of LEDs which are directly inserted into LED supports. The semiconductor support solves the problems that the number of placement positions of LED chips is small and cost of the LEDs is high. The semiconductor support comprises an upper support body, a middle support body provided with a beam and a lower support body. The upper support body is provided with multiple upper single bodies, each upper single body comprises an upper chip pin and an upper conductive pin, and the upper chip pins and the upper conductive pins are provided with chip placement positions. The lower support body is provided with multiple lower single bodies which are not symmetrical with the upper single bodies, each lower single body comprises a lower chip pin and a lower conductive pin, and the lower chip pins and the lower conductive pins are provided with chip placement positions. The upper single bodies and the lower single bodies are fixedly connected with the beam, the middle support body is provided with an upper chip pin lengthened area and a lower chip pin lengthened area, and the bottom of the upper chip pin lengthened area is lower than the top of the lower chip pin lengthened area. The upper portion and the lower portion of the semiconductor support are provided with the chip placement positions, the number of the LEDs is doubled, and LED cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of LEDs including LED brackets, and LEDs belong to semiconductors. Background technique [0002] LED brackets are brackets required for the production of semiconductors including LEDs, especially sheet-shaped in-line LED brackets. The existing in-line LED bracket has only the LED chip placement position on the top, and the LED chip placement position is few, the number of LEDs is small, the cost of the bracket is high, and the cost of the LED is high. Contents of the invention [0003] The present invention proposes a semiconductor support in order to solve the problems of fewer LED chip placement positions and high LED cost in the existing in-line LED support. The technical solution adopted in the present invention is: [0004] A semiconductor support, including a support, the support is divided into an upper support, a middle support and a lower support, the lower support is below the upper support,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/62
Inventor 邹志峰
Owner 邹志峰