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Packaging of power supplies using modular electronic modules

A technology of power supply and voltage, which is applied in the direction of output power conversion device, irreversible DC power input conversion to AC power output, electrical components, etc., and can solve the problem of large package occupation

Active Publication Date: 2017-06-30
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this arrangement requires space around the power supply to maneuver the individual cabinets into place and once the cabinets are assembled, the entire package occupies a large footprint

Method used

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  • Packaging of power supplies using modular electronic modules
  • Packaging of power supplies using modular electronic modules
  • Packaging of power supplies using modular electronic modules

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Embodiment Construction

[0029] For purposes of the following discussion, the terms "low pressure" and "medium pressure" are relative to each other and are intended to include their ordinary meanings as recognized by those of ordinary skill in the art. For example, the term "low voltage" may refer to a voltage lower than or equal to 1000 volts, or lower than or equal to 600 volts. The term "medium voltage" can refer to voltage levels as low as 600 volts or 1000 volts and as high as 35000 volts (35 kilovolts). The term "electrically connected" means that two or more components are part of an electrical circuit such that current can flow through the components, or that the components share a common voltage, either directly or via one or more intermediate components.

[0030] The present disclosure is directed to a single cabinet package for packaging the various components of a power supply similar to power supply 100 described above. The single cabinet package may have a smaller footprint than the pac...

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Abstract

A package for a power supply is disclosed. The enclosure may include a control compartment configured to house one or more control components, a transformer compartment positioned adjacent to the control compartment and configured to house a transformer, and a power cell compartment positioned adjacent to the control compartment and the transformer compartment. The power cell compartment may be configured to accommodate a plurality of power cells arranged in a plurality of groups. The power units may be housed within the power unit compartment such that each power unit in the first group is adjacent to at least two other power units in the first group. The voltage difference between adjacent power cells in a cluster can be less than an acceptable voltage tolerance.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to US Provisional Patent Application No. 61 / 502,593, filed June 29, 2011, entitled "Package for Power Supply Using Modular Electronic Modules." Background technique [0003] This disclosure relates to the construction and packaging of power supplies. More specifically, the present disclosure relates to the construction and packaging of three-phase power supplies using modular electronic modules. [0004] Power supplies configured for controlling the flow of energy between a first alternating current (AC) system and a second AC system are used in a number of commercial and industrial applications. For example, power supplies are typically used for AC motor control and operating systems. A different power source converts energy from a first frequency and voltage to a second frequency and voltage. One way to implement such a power supply is to include a driver with one or m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M7/00
CPCH02M7/49H02M7/003H02M7/4835H05K7/14325H05K5/0208H05K7/20936H05K7/1432
Inventor K.D.威斯纳E.A.诺瓦克
Owner SIEMENS AG