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Novel modified solid glue

A solid glue and modification technology, applied in the direction of adhesive types, adhesive additives, non-polymer adhesive additives, etc. Good binding, fast drying effect

Inactive Publication Date: 2014-05-14
QINGDAO SANLI XINYUAN ELECTRICAL APPLIANCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Glue is an intermediate that connects two materials. After being placed for a period of time, ordinary liquid glue will form an elastic solid due to dehydration and lose its bonding ability. It is also easy to block the outlet, and it is inconvenient to carry. Glue tends to saturate the paper being bonded and also contaminate areas other than the contact surfaces

Method used

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Embodiment Construction

[0013] Below in conjunction with specific embodiment the present invention is described in further detail;

[0014] A novel modified solid glue consists of the following components by weight:

[0015] Polyvinyl alcohol 30~60;

[0016] Acrylate copolymer emulsion 5~10;

[0017] Ethylene glycol 5~10;

[0018] Calcium formate 10-20;

[0019] Sodium stearate 5-10;

[0020] Paraben 2-8;

[0021] Water 10-20.

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PUM

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Abstract

The invention discloses novel modified solid glue which comprises the following components in parts by weight: 30-60 parts of polyvinyl alcohol, 5-10 parts of an acrylate copolymer emulsion, 5-10 parts of ethanediol, 10-20 parts of calcium formate, 5-10 parts of sodium stearate, 2-8 parts of nipagin and 10-20 parts of water. The modified solid glue has the advantages of being convenient, sanitary, good in cohesiveness, high in drying speed and free from leakage, diffusion and permeation phenomena in use.

Description

technical field [0001] The invention relates to a novel modified solid glue. Background technique [0002] Glue is an intermediate that connects two materials. After being placed for a period of time, ordinary liquid glue will form an elastic solid due to dehydration and lose its bonding ability. It is also easy to block the outlet, and it is inconvenient to carry. Glue tends to saturate the paper being bonded and also contaminate areas other than the contact surfaces. Contents of the invention [0003] Aiming at the deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a new type of modified solid glue with good cohesiveness and fast drying. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a novel modified solid glue, consisting of the following components by weight: [0005] Polyvinyl alcohol 30~60; [0006] Acrylate copolymer emulsion 5~10;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J129/04C09J133/04C09J11/06
Inventor 王淑秋
Owner QINGDAO SANLI XINYUAN ELECTRICAL APPLIANCES
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