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Inductively coupled plasma processing device and control method thereof

A plasma and inductive coupling technology, applied in the direction of plasma, circuits, discharge tubes, etc., can solve problems such as difficulties and achieve the effect of precise automatic control

Inactive Publication Date: 2016-12-28
LIGADP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In addition, in order to process larger-area substrates, these helical antennas need to be used in a plurality of different areas, but the structure of such antennas and impedance control for processing large-area substrates present greater difficulties.

Method used

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  • Inductively coupled plasma processing device and control method thereof
  • Inductively coupled plasma processing device and control method thereof
  • Inductively coupled plasma processing device and control method thereof

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Embodiment Construction

[0035] Next, embodiments of the inductively coupled plasma processing apparatus according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms. The embodiments described below are only used to fully disclose the present invention so that those skilled in the art can fully understand the protection scope of the invention.

[0036] figure 1 It is a figure which shows the inductively coupled plasma processing apparatus concerning the Example of this invention. Such as figure 1 As shown, the inductively coupled plasma processing apparatus according to the present invention includes a chamber 10 having a gate 14 and an exhaust hole 11 required to evacuate the inside of the process space. Inside the chamber 10 there is a workbench 12 for placing substrates (wafers or transparent substrates of different sizes). An electrostatic chuck 13 fo...

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Abstract

The inductively coupled plasma processing apparatus according to the present invention includes: a chamber; a source coil provided outside the upper dielectric window of the chamber; a variable capacitor control device connected to the source coil for controlling a variable capacitor of impedance, a motor for automatically rotating the variable capacitor, and an external encoder for detecting the rotation of the motor; The motor operation input value to the motor is used to determine whether the operation of the variable capacitor is abnormal. In the inductively coupled plasma processing apparatus and its control method according to the present invention, the operation of variable capacitors connected to each source coil and used to adjust the impedance is precisely controlled by a motor, so as to effectively control the impedance of a plurality of source coils, Furthermore, it is possible to precisely and automatically control a plurality of variable capacitors.

Description

technical field [0001] The present invention relates to an inductively coupled plasma processing device and its control method, more specifically, an inductively coupled plasma processing device capable of automatic impedance control and its control method. Background technique [0002] Inductively coupled plasma processing devices are devices used to perform etching processes or deposition processes in semiconductor and display manufacturing processes. The inductively coupled plasma processing apparatus used for the etching process has a very good etching effect compared with the reactive ion etching apparatus or the capacitively coupled plasma etching apparatus. [0003] However, it is difficult for an inductively coupled plasma processing apparatus to etch a large-area substrate. Usually, the antenna is arranged on the upper part of the vacuum chamber of the inductively coupled plasma processing apparatus. In order to efficiently etch a large-area substrate, antenna con...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05H1/46
CPCH01J37/3211H01J37/32183H01J37/32926H05H1/46H05H1/4652H05H2242/20
Inventor 林正焕
Owner LIGADP