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Inductively coupled plasma processing apparatus and control method thereof

A technology of plasma and inductive coupling, applied in the direction of plasma, circuit, discharge tube, etc., can solve difficult problems and achieve the effect of precise automatic control

Inactive Publication Date: 2014-05-21
LIGADP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In addition, in order to process larger-area substrates, these helical antennas need to be used in a plurality of different areas, but the structure of such antennas and impedance control for processing large-area substrates present greater difficulties.

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  • Inductively coupled plasma processing apparatus and control method thereof
  • Inductively coupled plasma processing apparatus and control method thereof
  • Inductively coupled plasma processing apparatus and control method thereof

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Embodiment Construction

[0035] Hereinafter, embodiments of the inductively coupled plasma processing apparatus according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms. The embodiments described below are only used to fully disclose the present invention so that those skilled in the art can fully understand the protection scope of the invention.

[0036] figure 1 It is a diagram showing an inductively coupled plasma processing apparatus according to an embodiment of the present invention. Such as figure 1 As shown, the inductively coupled plasma processing apparatus according to the present invention includes a chamber 10 having a gate 14 and an exhaust hole 11 required to vacuum the inside of the process space. Inside the chamber 10, there is a table 12 for placing substrates (wafers or transparent substrates of different sizes). An electrostatic chuck 1...

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Abstract

The invention relates to an inductively coupled plasma processing apparatus including a cavity, a source coil arranged at the outer side of a dielectric window at the upper part of the cavity, a variable capacitor control device including a variable capacitor connected with the source coil and used for controlling impendence, a motor enabling the variable capacitor to automatically rotate, and an external encoder for detecting the rotation of the motor; and a controller which determines motion abnormity of the variable capacitor by comparing the external encoder output value output from the external encoder and the motor motion input value input to the motor. The inductively coupled plasma processing apparatus and a control method thereof precisely control the motion of the variable capacitor which is connected to each source coil and is used for impedance adjustment by means of the motor to effectively perform impedance control to the source coils and to precisely perform automatic control of the variable capacitors.

Description

Technical field [0001] The present invention relates to an inductively coupled plasma processing device and a control method thereof, more specifically, an inductively coupled plasma processing device capable of automatically controlling impedance and a control method thereof. Background technique [0002] An inductively coupled plasma processing device is a device used to perform an etching process or a deposition process in semiconductor and display manufacturing processes. Compared with the reactive ion etching device or the capacitively coupled plasma etching device, the inductively coupled plasma processing device used for the etching process has a very good etching effect. [0003] However, it is difficult for inductively coupled plasma processing equipment to etch large-area substrates. Generally, the antenna is installed in the upper part of the vacuum chamber of the inductively coupled plasma processing apparatus. In order to effectively etch large-area substrates, anten...

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Application Information

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IPC IPC(8): H05H1/46
CPCH01J37/3211H01J37/32183H01J37/32926H05H1/46H05H1/4652H05H2242/20
Inventor 林正焕
Owner LIGADP