Floating transfer heat treatment device

Abstract

Provided is a heat treatment apparatus with levitation and transportation for cooling heated substrates in a short time. Multiple levitation and transportation units are arranged in the heat treatment apparatus (1), and heat and transport the substrates while levitating the substrates at the same time through ultrasonic vibration sequentially. Each of the levitation and transportation units comprises a vibration plate part which levitates the substrates through the ultrasonic vibration; an ultrasonic generation part which applies the ultrasonic vibration to the vibration plate part; a transportation part which supports the end parts of the substrates and transports the substrates along the direction perpendicular to the levitating direction of the substrates. The heat treatment apparatus has a heating region (2) and a cooling region (3). In the heating region, the levitation and transportation units have heater parts for heating the vibration plate parts of the levitation and transportation units; and in the cooling region, the levitation and transportation units do not have heater parts.

Description

technical field [0001] The present invention relates to a floating transfer heat treatment device for heating and cooling a substrate while carrying out floating transfer of the substrate. Background technique [0002] In flat panel displays such as liquid crystal displays and plasma displays, substrates coated with a resist solution (referred to as coated substrates) are used. The coated substrate is produced by uniformly coating a resist liquid on a substrate with a coating device to form a coating film, and then drying the coating film with a heat treatment device. [0003] In this heat treatment apparatus, there are, for example, Patent Document 1 and Figure 11 Shown is the floating transfer heat treatment unit. Such as Figure 11 As shown, the floating transfer heat treatment device 90 has a heating area 91, and the heating area 91 heats the substrate W by the temperature of the heating area 91 itself in a state where the substrate W is floated by ultrasonic vibration...

AI Technical Summary

Problems solved by technology

[0009] However, in the above Patent Document 1 and Figure 11 In the floating transfer heat treatment apparatus 90 shown, there is a problem that it takes time to cool the substrate.

Specifically, in order to transfer the substrate W from the floating transfer thermal processing device 90 to the cooling unit 92, the transfer robot 93 located between the floating transfer thermal processing device 90 and the cooling unit 92 needs to receive the substrate W from the floating transfer thermal processing device 90, Then, the transfer robot 93 places the substrate W on the cooling unit 92. Therefore, if this time is included in the cooling time of the substrate W, it may not be accommodated within the range of the cooling time that can be prepared by the user.

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