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Method for preventing sealing bag packaging printed circuit board from damage and printed circuit board

A printed circuit board, packaging and printing technology, applied in the direction of printed circuit components, etc., can solve the problems of easy to pierce packaging bags, packaging bags can not effectively protect the printed circuit board, poor welding and other problems

Inactive Publication Date: 2014-07-02
SHENZHEN GONGJIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The corners of the traditional printed circuit board are at right angles, so it is easy to pierce the packaging bag, causing moisture and oxygen in the air to enter the packaging bag, oxidizing the pads on the printed circuit board, resulting in poor soldering, and causing the packaging bag to fail to protect effectively A printed circuit board

Method used

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  • Method for preventing sealing bag packaging printed circuit board from damage and printed circuit board
  • Method for preventing sealing bag packaging printed circuit board from damage and printed circuit board

Examples

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Embodiment Construction

[0019] A method for preventing damage to a sealed bag for packaging a printed circuit board includes the following steps: making the sharp corners of the printed circuit board smooth. Smooth is relative to sharp, and the printed circuit board with smooth corners will not scratch the sealed bag. The smooth shape can be in various shapes, such as arc shape, wave shape and so on.

[0020] In a preferred embodiment, when the printed circuit board is rectangular, making the sharp corners of the printed circuit board smooth is specifically grinding the four right angles of the printed circuit board into rounded corners. A printed circuit board with rounded corners such as figure 1 shown. Sanding into rounded corners is relatively easy, and the effect of scratch resistance is also very good. When the printed circuit board has other shapes, the sharp corners of the printed circuit board can also be ground into rounded corners according to the manner of the foregoing embodiments. T...

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PUM

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Abstract

The invention discloses a method for preventing a sealing bag packaging a printed circuit board from damage. The method comprises the step of arranging the sharp corners of a printed circuit board into a smooth shape. The invention further discloses a printed circuit board of which the corners are smooth. According to the method and the printed circuit board, as the sharp corners of the printed circuit board are arranged into a smooth shape, a sealing bag can be prevented from being scratched by sharp corners, and therefore, the printed circuit board is well protected.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to a method for preventing damage to a sealed bag for packaging printed circuit boards and a printed circuit board. Background technique [0002] The packaging method of printed circuit boards is usually sealed with anti-static bags, so as to ensure that moisture and oxygen in the air cannot enter the packaging bags. The corners of the traditional printed circuit board are at right angles, so it is easy to pierce the packaging bag, causing moisture and oxygen in the air to enter the packaging bag, oxidizing the pads on the printed circuit board, resulting in poor soldering, and causing the packaging bag to fail to protect effectively A printed circuit board. Contents of the invention [0003] Based on this, it is necessary to provide a method for preventing damage to the sealed bag for packaging the printed circuit board. [0004] In addition, a printed circuit board is also p...

Claims

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Application Information

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IPC IPC(8): H05K1/02
Inventor 王达国
Owner SHENZHEN GONGJIN ELECTRONICS CO LTD