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Apparatus for treating substrate using supercritical fluid, substrate treatment system comprising the same, and method for treating substrate

A technology for processing devices and substrates, which can be used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as contamination of substrates

Active Publication Date: 2014-09-17
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Condensed or deposited impurities can re-contaminate the substrate

Method used

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  • Apparatus for treating substrate using supercritical fluid, substrate treatment system comprising the same, and method for treating substrate
  • Apparatus for treating substrate using supercritical fluid, substrate treatment system comprising the same, and method for treating substrate
  • Apparatus for treating substrate using supercritical fluid, substrate treatment system comprising the same, and method for treating substrate

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Embodiment Construction

[0057] Hereinafter, the inventive concept will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the inventive concept are shown. From the following exemplary embodiments which will be described in more detail in conjunction with the accompanying drawings, the advantages and features of the inventive concept and the method for realizing them will become apparent. However, it should be noted that the inventive concept is not limited to the following exemplary embodiments, but can be implemented in various forms. Thus, the exemplary embodiments are only provided to disclose the inventive concept and let those skilled in the art understand the types of the inventive concept. In the drawings, embodiments of the inventive concept are not limited to the specific examples provided herein, and are exaggerated for clarity.

[0058] The terms used herein are only for the purpose of describing specific embodiments and are not intended to...

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PUM

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Abstract

Substrate treatment systems are provided. The substrate treatment systems may include a treating device configured to treat a substrate with a supercritical fluid, and a supplying device configured to supply the supercritical fluid to the treating device. The treating device may include a supercritical process zone in which the substrate is treated with the supercritical fluid, and a pre-supercritical process zone in which the supercritical fluid is expanded and then provided into the supercritical process zone to create a supercritical state in the supercritical process zone.

Description

Technical field [0001] The inventive concept relates to a substrate processing system, and more specifically, to a substrate processing system capable of performing a supercritical process. Background technique [0002] A supercritical fluid is any substance at a temperature and pressure above its critical point, in which there is no obvious liquid and gas phase. Therefore, it has the properties of gas and liquid. The supercritical process using supercritical fluid can be used in the semiconductor industry to obtain various advantages. For example, the supercritical process may be used for the substrate drying process, cleaning process, and / or etching process. When the high-pressure supercritical fluid is supplied into the process chamber, it can expand rapidly. As a result, the temperature and solubility of the supercritical fluid may decrease, so that a small amount of impurities included in the supercritical fluid may undesirably condense or deposit. Condensed or deposited...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67126H01L21/68785H01L21/67751
Inventor 赵庸真高镛璿金庆燮金光秀金石训吴政玟李根泽张原浩田溶明
Owner SAMSUNG ELECTRONICS CO LTD