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Housing, method of making housing, and electronic device

A technology for electronic equipment and casings, applied in the field of casings showing metal textures, can solve problems such as difficulties and reduced portability of electronic equipment.

Active Publication Date: 2018-09-14
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Metal materials can be used to make the casings of electronic devices beautiful, but it is difficult to process metal materials into specific shapes
That is, there are many difficulties in achieving the desired shape design with metallic materials
Also, when the case of the electronic device is formed of a metal material, the portability of the electronic device is reduced due to the weight of the metal material

Method used

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  • Housing, method of making housing, and electronic device
  • Housing, method of making housing, and electronic device
  • Housing, method of making housing, and electronic device

Examples

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Embodiment Construction

[0029] discussed below Figures 1A to 15 And the various embodiments used to describe the principles of the disclosure in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the disclosure. Those skilled in the art will understand that the principles of the present disclosure may be implemented in any suitably arranged electronic device and its housing.

[0030] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. In this process, the thickness of lines and the size of constituent elements shown in the drawings may be exaggerated for clarity and convenience. Further, the following terms are defined in consideration of their functions in the present disclosure and may be changed according to user's or administrator's intention and custom. Therefore, these terms should be defined based on the contents of the entire specification. Further, although...

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Abstract

The invention discloses a housing comprising an injection molded preform having a recess on at least a portion of its surface, a deposit layer deposited on the surface of the injection molded preform, and a lacquer layer formed on the deposit layer. The deposited layer may directly contact the surface of the injection molded preform. The method of manufacturing the housing includes injection molding an injection preform having recesses on its surface, forming a deposit layer directly contacting the surface of the injection preform, and forming a lacquer layer on the deposit layer.

Description

technical field [0001] The present disclosure relates to a case exhibiting a metal texture, and a method of manufacturing the same. Background technique [0002] Generally, electronic devices include portable communication devices, MP3 players, portable multimedia players (PMPs), and electronic books, and any suitable device through which a user can access various content while carrying them. [0003] Users may prefer to choose an electronic device with an attractive design if the price and functionality of the electronic devices are not significantly different. Therefore, the appearance of the electronic device, that is, the design of the housing, will be the main factor affecting the user's selection of the electronic device. [0004] Metal materials can be used to make the casings of electronic devices exquisite, but it is difficult to process metal materials into specific shapes. That is, there are many difficulties in realizing the design of a desired shape with metal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00B44C5/00B44F9/10
CPCB29C45/0053G06F1/1626B29C2045/0079B05D3/144B05D5/067H05K5/0243H05K5/0018H05K5/03H04M1/0249H05K5/0017
Inventor 黄昶渊金原兑金学柱崔钟哲
Owner SAMSUNG ELECTRONICS CO LTD