Apparatus for manufacturing molded articles, method for manufacturing molded article and molded article

A production device and production method technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low cost, complex structure of resin packaging devices, and reduced resin use efficiency

Active Publication Date: 2014-10-01
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Further, since useless resin is molded in the resin channel, the use efficiency of the resin is lowered, and a mechanism for cutting and discarding the useless resin is required
Therefore, the structure of the resin-encapsulated device becomes very complicated, resulting in an increase in size of the device and a decrease in productivity

Method used

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  • Apparatus for manufacturing molded articles, method for manufacturing molded article and molded article
  • Apparatus for manufacturing molded articles, method for manufacturing molded article and molded article
  • Apparatus for manufacturing molded articles, method for manufacturing molded article and molded article

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Embodiment Construction

[0110] The molded product production apparatus of the present invention has the following configuration. That is, the through passage is provided in the molding die facing the cavity. The injection member can move forward and backward freely in the through channel. A liquid resin made of a thermosetting resin is supplied to a resin flow channel provided inside the injection member. The liquid resin is injected into the cavity from the injection port provided at the front end of the injection member through the opening provided in the support. The resin is molded and hardened by heating the injected liquid resin. The injection member is retracted from the cured resin to automatically separate the cured resin from the front end of the injection member.

[0111] Below, refer to Figure 1 to Figure 11 , an example of the molded product production apparatus according to the present invention will be described. Any drawing in the present application is appropriately omitted or ...

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PUM

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Abstract

The invention discloses an apparatus for manufacturing molded articles, which adopts a movable pouring injection nozzle, and can be used for molding all the articles by using the liquid resin. The elevated pouring injection nozzle(15) used for feeding the movable liquid resin is disposed in a penetrating channel (19) in a lower die (11).By adopting a pouring injection nozzle driving mechanism (16), the pouring injection nozzle (15) can be lifted to an opening (23) of a supporting body (22) of the lower die (11), and therefore a resin channel (24),a pouring opening (25), and an opening (23)are communicated with each other, and the liquid resin can be injected in a cavity (17) of an upper die (7). The hard resin can be formed by hardening the liquid resin, and the resin packaging of a chip element (21) of the supporting body (22). The pouring injection nozzle (15) is lowered, and the pouring opening (25) of the pouring injection nozzle (15) can be separated from the hardening resin. The refrigerant flowing on the outer side of the wall of the resin channel (24) can be provided for the pouring injection nozzle (15) after being cooled.

Description

technical field [0001] The present invention relates to resin molding using liquid resin. In particular, it relates to a molded article production apparatus, a molded article production method, and a molded article that mold a cured resin that hardens a liquid resin on a support. Background technique [0002] Conventionally, resin encapsulation of electronic components using transfer molding has been widely promoted as a resin molding technique. In resin encapsulation using the transfer molding method, electronic components mounted on lead frames or substrates are resin-encapsulated by hardening resin. The electronic components referred to here include electronic components other than integrated circuits, light emitting diodes (LEDs), and the like, and since most of them are chip-shaped, they are hereinafter referred to as chip components. [0003] A method of resin-encapsulating chip components mounted on a substrate using transfer molding is performed as follows. First,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/03B29C45/14H01L21/56
CPCH01L21/56B29C45/03B29C45/14B29C45/1742B29C45/02
Inventor 川洼一辉德山秀树平田雄亮
Owner TOWA
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