Uniform temperature plate with cooling fins

Abstract

The invention relates to a uniform temperature plate with cooling fins and a manufacturing method thereof. The uniform temperature plate comprises an upper cover plate and a lower cover plate. The manufacturing method mainly comprises the following step: through the manufacture procedure of backing-off cutting, the surface of the upper cover plate undergoes backing-off cutting to form a plurality of cooling fins which are adjacent to each other at intervals and each cooling fin and the upper cover plate are an integral connected structure. Thus, only by one-step welding process, matching and combination of the upper cover plate and the lower cover plate can be completed to form the uniform temperature plate with the cooling fins.

Description

technical field [0001] The invention relates to a uniform temperature plate and its manufacturing method, in particular, the upper cover plate is formed by shoveling to form a plurality of integrally formed heat dissipation fins, so only one welding process is required to complete a uniform temperature chamber with heat dissipation fins. warm plate. Background technique [0002] The known vapor chamber is used to match electronic heating components with a narrow installation space or a large area to provide heat dissipation function. It mainly includes an upper cover and a lower cover that match each other. The upper and lower cover plates are welded together after the corresponding covers are closed, and the interior is a sealed inner chamber in a vacuum state. The inner chamber has a support structure and capillary tissue on the side wall, and is pre-filled with working fluid for various electronic devices. Heat-generating components (such as CPU, etc.) are attached to ac...

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Problems solved by technology

[0003] In order to strengthen the heat dissipation effect of the conventional temperature chamber, there is also a second welding process on the upper cover of the temperature chamber, and a heat dissipation fin group is welded on the surface of the upper cover to make the temperature chamber in the After absorbing the heat, the heat can be transferred to the heat dissipation fin group to achieve the purpose of accelerating heat dissipation; however, the above-mentioned conventional temperature chamber must go through the second welding process first and then, and the first welding is aimed at the upper , the lower cover plate, the second welding is aimed at the combination of the upper cover plate and the heat dissipation fin group, therefore, when the second high temperature welding is performed in the second reflow, it is easy to cause damage to the previously welded structure, As a result, the defect rate of this kind of vapor chamber with heat dissipation fins remains high, which is an urgent problem to be solved at present.

[0004] In addition, in the above-mentioned conventional temperature chamber, the heat dissipation fin group is bonded to the surface of the upper cover plate by welding, which must use soldering materials such as solder, so capillary phenomenon will be caused in the joint part after welding, and heat will be generated. resistance, which is very unfavorable for heat transfer, resulting in poor heat dissipation

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