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Coating manufacturing method

A manufacturing method and coating technology, applied to semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve problems such as productivity decline, yield decline, and workpiece damage

Active Publication Date: 2018-11-13
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, at this time, since the cover tape is attached, the cover tape needs to be peeled off after the plating treatment, so there is a problem that the productivity is lowered.
In addition, when the thickness of the workpiece is thin, such as a lead frame, the workpiece is damaged when the cover tape is peeled off, and there are also problems such as a decrease in yield.

Method used

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  • Coating manufacturing method
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0060] In the present example, a plated film was produced on the surface of the workpiece in the following procedure.

[0061] Such as figure 1 As shown, by connecting a polarity inversion power supply 15 between the workpiece 12 and the electrode 13 and connecting a DC power supply 16 between the workpiece 12 and the electrode 14, the coating film was produced.

[0062] At this time, as the workpiece 12, a metal plate composed of a copper alloy (C194) was used. In addition, as the composition of the plating solution, copper sulfate containing 200g / L, sulfuric acid of 100g / L, chlorine gas of 50ppm, brightener of 2ml / L (manufactured by Rohm&Hass Co., trade name: MICROFILL TM EVF BRIGHTER), 10 ml / L leveler (manufactured by Rohm & Hass Co., trade name: MICROFILL TM EVF LEVELER), and 20 ml / L polymer (manufactured by Rohm & Hass Co., trade name: MICROFILL TM EVF C2) plating solution.

[0063] After producing the coating film under the above-mentioned conditions, it can be co...

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Abstract

A coating manufacturing method for forming a coating on a workpiece having one main surface and another main surface on the opposite side of the one main surface, wherein: between the workpiece and the connecting a polarity inversion power supply between the electrodes arranged facing the one main surface of the workpiece; connecting a DC power supply between the workpiece and the electrodes arranged facing the other main surface of the workpiece; and simultaneously Plating treatment is performed on the one main surface and the other main surface of the workpiece.

Description

technical field [0001] The invention relates to a coating manufacturing method. Background technique [0002] For example, like the joint between a lead frame and a sealing resin, the joint between a metal part and a resin part may peel off due to heating or the like during manufacture or use, and changes over time may cause both Separation occurs between. [0003] For this reason, some methods for improving the bonding strength between metal parts and resin parts have been proposed in the prior art. For example, a method of treating the surface of a metal member to a rough surface (also referred to as a "rough surface") has been proposed. [0004] As a method of forming a roughened surface on a metal surface, for example, Patent Document 1 discloses a roughened rolled copper sheet, which is obtained by placing the rolled copper sheet in an electrolyte solution containing a gloss solution, and using Asymmetric positive and negative pulses under predetermined conditions ar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/18C25D7/06
CPCH01L2224/48091H01L2224/48247H01L2924/00014C25D5/18C25D17/007C25D5/611C25D5/605C25D5/627C25D7/00H01L23/49582
Inventor 吴宗昭有贺庸介
Owner SHINKO ELECTRIC IND CO LTD