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A polishing head with a vacuum suction cup

A vacuum suction cup and polishing head technology, which is applied in the field of polishing head, can solve the problems of complex processing work, low production efficiency, and many consumables, and achieve the effects of saving chemical reagents, stable pressure, and convenient pressure and speed

Active Publication Date: 2017-10-24
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pasting work and post-polishing processing work are more complicated, the production efficiency is low, and there are more consumables

Method used

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  • A polishing head with a vacuum suction cup
  • A polishing head with a vacuum suction cup
  • A polishing head with a vacuum suction cup

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Embodiment

[0024] The present invention will be further described below in conjunction with the drawings. There are two schemes of the present invention. The present invention is not limited to the specific structure of the embodiment, and the equivalent transformations of other similar structures fall within the protection scope of the present invention.

[0025] The present invention has a scheme, and the overall layout of the two schemes is similar, such as Image 6 As shown, the polishing heads of the two solutions are composed of a suction cup 25, a high-speed rotary joint 26, a vacuum hose 27, and a vacuum generator 28. The suction cup 25 is assembled and connected with the high-speed rotary joint 26 through threads. The other end of the high-speed rotary joint 26 is connected to the vacuum hose 27, the other end of the vacuum hose 27 is connected to the vacuum generator 28, and the air inlet of the vacuum generator 28 is connected to the air inlet pipe 29. connection.

[0026] The di...

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Abstract

The invention discloses a polishing head with a vacuum suction cup. According to the polishing head, a workpiece can be quickly and stably sucked, independent rotation can be realized, the rotation speed can be adjusted by a polishing machine, and the polishing pressure can be changed. The polishing head consists of the suction cup, a high-speed rotary joint, a vacuum hose and a vacuum generator which are connected in series in sequence. The suction cup is formed by two schemes: 1, the suction cup comprises a disk face, a disk bottom, a vacuum tube, bolts for connecting the disc face with the disc bottom, and pressing blocks of different masses, wherein the pressing blocks of different masses are combined to adjust the polishing pressure on the workpiece; 2, the suction cup comprises a disc face, a disc bottom, a positioning shaft, a vacuum tube, a positioning cylinder, a spring, a pressure regulating nut, a retainer, a limiting rack and a retainer end face ring, wherein the polishing pressure acting on the workpiece is changed by compressing the spring through the pressure regulating nut. The polishing head can be a substitute for the conventional methods for adhering the workpiece through substances such as glue and soluble wax, and is low in cost and easy to operate, and the machining efficiency and the machining precision can be improved. The polishing head can be combined with a rotary swing gravity type grinding and polishing machine for use.

Description

Technical field [0001] The invention relates to a polishing head used in combination with a rotary swing gravity grinding and polishing machine, in particular to a polishing head which uses a vacuum suction cup to absorb a workpiece, can adjust the polishing pressure, and can independently rotate, and an operation method thereof. Background technique [0002] A major advantage of the gravity grinding and polishing machine is that it can distribute the pressure on the workpiece smoothly and evenly. The traditional workpiece clamping method is to use some adhesive substances, such as glue, soluble wax and other substances to stick the workpiece on the bottom surface of the briquette. It is difficult to control the uniformity of the sticky substance when it is applied to the polishing part, and the uneven thickness will directly affect the overall flatness of the polishing part. Changing the working pressure requires changing to a different pressure block, and repeated pasting will ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B41/04B24B29/00
CPCB24B29/00B24B41/04
Inventor 魏昕袁文强谢小柱胡伟钟静
Owner GUANGDONG UNIV OF TECH
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