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Temperature equilibrium apparatus for constructing whole-spacecraft thermal bus

A thermal bus, construction technology, used in spacecraft applications

Active Publication Date: 2015-01-28
AEROSPACE DONGFANGHONG DEV LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the defects existing in the prior art, the present invention provides a temperature equalizing device for constructing the whole star thermal bus, which can solve the problem that the local temperature of the spacecraft is too high or too high. Low problem, realize the isothermal design of the target area, and at the same time, easily realize the spacecraft thermal bus design, and solve the design problem of thermal control components adapting to standardization, modularization and plug-and-play spacecraft

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  • Temperature equilibrium apparatus for constructing whole-spacecraft thermal bus

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0015] In order to improve the versatility of the device to achieve the purpose of modular rapid assembly, to ensure the mechanical strength of the structure and the mechanical resistance of the device itself, a high-performance, generalized modular structure can be achieved through the integrated design of mechanical and heat, and to solve multiple problems. The device combination has the defect that the force and heat of the connection point are weak. The present invention proposes a temperature equalizing device for constructing a whole-star thermal bus. As shown in Figure 1, the temperature equalizing device is in the form of a fishbone structure, including a central hot runner, branch hot runners and flanges; The high-efficiency heat pipe is used as the central hot runner of the device, and a heat-conducting copper strip with high thermal ...

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Abstract

Provided in the invention is a temperature equilibrium apparatus for constructing a whole-spacecraft thermal bus. On the basis of a fishbone-shaped structural moulding, a heat tube with high thermal conductivity is used as a central thermal runner of the apparatus; and heat-conducting copper bars with high thermal conductivity are welded to the two sides, wherein the copper bars can be bent. Flange structures are formed at the two ends of the apparatus; and fastening and welding solidification among a plurality of units can be carried out by using a locking device. The provided temperature equilibrium apparatus is welded and fixed with a temperature uniform structure. The performance of the apparatus is superior to the heat conducting property of a pre-buried / conventional adhesive-bonded external heat tube. According to the platform structure convention, the temperature equilibrium apparatuses with particular specifications can be produced in a batch mode; and the temperature equilibrium apparatuses with specific heat-conducting capabilities can be produced in a batch mode according to the platform heat-conducting performance requirement.

Description

technical field [0001] The invention relates to the application field of spacecraft, in particular to a temperature equalizing device for a spacecraft. Background technique [0002] With the development trend of high integration, high heat consumption, low quality and small size of micro-satellites becoming more and more obvious, the thermal conductivity of the whole satellite needs to be further improved; in addition, the design cycle, production cycle and platform of thermal control components of standardized and modular satellites Adaptability and so on put forward higher requirements, and the development of an isothermal module that constructs the entire star thermal bus is the only way to go for the development of thermal control design. [0003] At present, the thermal control design of each satellite adopts spraying high-emissivity coating to enhance the heat radiation and heat exchange of each equipment and cabin, and at the same time, attaches and pre-embeds high-co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/19
Inventor 孙日思
Owner AEROSPACE DONGFANGHONG DEV LTD