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Materials suitable for anodic bonding and methods for their preparation

An anode and composite technology, which is applied in the field of anode bonding materials and their preparation, can solve the problems of large bonding stress, damage to the front-end process and structure of micro-electromechanical systems, and high price of electrolyte materials, and can reduce the bonding temperature and thermal expansion. Small coefficient, the effect of reducing the residual stress of sealing

Active Publication Date: 2017-01-18
TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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Problems solved by technology

[0004] However, Pyrex7740 glass can achieve ideal bonding only at a higher bonding temperature, which will cause greater bonding stress and cause damage to the front-end process and structure of the MEMS; at the same time, the price of Pyrex7740 glass electrolyte material is high

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  • Materials suitable for anodic bonding and methods for their preparation
  • Materials suitable for anodic bonding and methods for their preparation

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] An embodiment of the present invention provides a method for preparing a polymer solid electrolyte material suitable for anodic bonding, the method comprising the following steps:

[0018] S1. Select LiBF 4 , LiPF 6 ,TiO 2 , Al 2 o 3 One of the same mass of LiClO 4 After mixing uniformly, the obtained composite is sintered by a solid state reaction method.

[0019] That is, the raw material of the composite can be LiBF 4 and LiClO 4 , can also b...

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Abstract

The embodiments of the invention provide a material applicable to anode bonding and a preparation method thereof and relate to the field of material preparation. Due to the application of the material, the preheating temperature during anode bonding encapsulation can be lowered, the residual stress of sealing can be reduced, and the quality of microelectronic device encapsulation is improved. The preparation method comprises the steps: uniformly mixing one of LiBF4, LiPF6, TiO2 and Al2O3 and an equal amount of LiClO4, and sintering by adopting a solid-phase reaction method, so as to obtain a complex; and baking the complex and polyethylene oxide (PEO) powder, and then, putting into an agate ball tank for ball milling, thereby preparing the macromolecular solid electrolyte material applicable to anode bonding.

Description

technical field [0001] The invention relates to the field of material preparation, in particular to a material suitable for anodic bonding and a preparation method thereof. Background technique [0002] Packaging is one of the critical aspects of complex MEMS fabrication. Anodic bonding is the most important method in packaging technology. Its biggest feature is that it can directly realize the solid-state connection of materials at a relatively low temperature without adding intermediate materials by using a DC electric field. This method has the advantages of simple process, high bonding strength and good sealing performance. [0003] At present, when anodic bonding technology is used for packaging, the research is mostly concentrated on the structure of glass and silicon, glass and metal. In the bonding process, glass is used as the cathode material, and metal or silicon is used as the anode material. As the cathode bonding material, only Pyrex7740 glass produced by Cor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/02C08K3/00C08K3/24C08K3/22C08K3/38C08K3/32
Inventor 阴旭刘翠荣吴志生
Owner TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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