Chip with electrostatic discharge protection

Abstract

A chip having an electrostatic discharge protection function comprises two power rail lines, a pin, a P type fin field effect transistor, an N type fin field effect transistor, two fin resistors, two diodes and an electrostatic discharge unit. The pin is electrically connected with one power rail line sequentially through one fin resistor and the P type fin field effect transistor and is electrically connected with the other power rail line sequentially through the other fin resistor and the N type fin field effect transistor. Control ends of the two above fin field effect transistors are used for receiving transmission signals. The pin is electrically connected with the two power rail lines respectively through the two diodes. Additionally, the electrostatic discharge unit is electrically connected between the two power rail lines to form into an electrostatic discharge path.

Description

technical field [0001] The invention relates to a chip, in particular to a chip with electrostatic discharge protection function. Background technique [0002] With the rapid development of science and technology and the advancement of semiconductor process technology, the size of the electronic components inside the chip has shrunk to only tens of nanometers, so unpredictable sudden voltages or currents may cause damage to these tiny electronic components. For example, electrostatic discharge (ElectroStatic Discharge, ESD) may be introduced through the external pins (Pins) of the chip to cause damage to the electronic components inside the chip. [0003] Under such circumstances, how to protect the electronic components inside the chip from being damaged by sudden electrostatic discharge has become an important issue that every chip design manufacturer needs to face. Contents of the invention [0004] The invention provides a chip with electrostatic discharge protection ...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of science and technology and the advancement of semiconductor process technology, the size of the electronic components inside the chip has shrunk to only tens of nanometers, so unpredictable sudden voltages or currents may cause damage to these tiny electronic components. For example, electrostatic discharge (ElectroStatic Discharge, ESD) may be introduced through the external pins (Pins) of the chip and cause damage to the electronic components inside the chip.

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