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Magnetron sputtering magnet system, control method thereof and magnetron sputtering device

A magnetron sputtering and control method technology, applied in the field of magnetron sputtering, can solve the problems of inconsistency between sputtering and consumption, reduction of target utilization rate, inconsistency of target influence, etc.

Active Publication Date: 2015-02-18
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the existence of the magnet spacing, the strong magnetic area and weak magnetic area of ​​the bar magnet have inconsistent effects on the target, resulting in inconsistent sputtering and consumption of the target under the influence of uneven magnetic field strength, which reduces the target's efficiency. Utilization

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  • Magnetron sputtering magnet system, control method thereof and magnetron sputtering device
  • Magnetron sputtering magnet system, control method thereof and magnetron sputtering device
  • Magnetron sputtering magnet system, control method thereof and magnetron sputtering device

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0037] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no interveni...

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Abstract

The invention discloses a magnetron sputtering magnet system, a control method thereof and a magnetron sputtering device. The magnetron sputtering magnet system comprises a driving unit, a connecting unit and at least one magnetic unit, wherein the magnetic unit is connected with the driving unit by virtue of the connecting unit; the magnetic unit comprises a first magnet and a second magnet; the first magnet and the second magnet are centrally symmetrical, and the magnetic induction line locus of the first magnet is opposite to the magnetic induction line locus of the second magnet; the driving unit respectively drives the first magnet and the second magnet to circularly move parallel to the plane of a target, the movement locus of the first magnet is coincided with the movement locus of the second magnet, and the movement loci are closed loci; the magnetic induction intensity of the surface of the target is periodically changed, so that the magnetic induction intensity of the target is more uniformly distributed, the consumption degree is more uniform, and the utilization rate of the target is enhanced. The control method of the magnetron sputtering magnet system, which is disclosed by the invention, is easy to operate and easy to popularize. The invention also provides the magnetron sputtering device with the magnetron sputtering magnet system.

Description

technical field [0001] The invention relates to the field of magnetron sputtering, in particular to a magnetron sputtering magnet system, a control method thereof and a magnetron sputtering device. Background technique [0002] In the field of Flat Panel Display (FPD), magnetron sputtering devices are often used to form various thin films. Magnetron sputtering is to place a ferromagnetic unit behind the target to enhance the sputtering process in the form of magnetic field assistance. [0003] Generally, the magnet system is composed of several parallel bar magnets at intervals. These bar magnets are driven by a group of motors, and the bar magnets are moved left and right on the plane parallel to the target during the sputtering process, thereby improving the uniformity of the magnetic field intensity to a certain extent. [0004] However, due to the existence of the magnet spacing, the strong magnetic area and weak magnetic area of ​​the bar magnet have inconsistent effe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/35C23C14/54
Inventor 张杨
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD