A sample processing method for abnormal metal wire pressure welding

Abstract

The invention discloses a method for processing a sample abnormal in metal wire pressure welding. The method is applied in the semiconductor chip testing structure sample which comprises a packaging base and a chip. The method includes step 1, removing a metal wire used for connecting a metal pad on the chip with a bonding pad on the packaging base in the semiconductor testing structure sample abnormal in metal wire pressure welding; step S2, adopting a detection probe to test resistance between metal pads abnormal in any two welding balls; step 3, bombarding the metal pads to other metal layers of the chip through a laser; step 4, using the detection probe to test resistance, and judging whether the metal pads are disconnected with the other metal layers or not; step 5, re-performing pressure welding on the sample. By the method, short-circuit between the metal pads due to metal wire pressure welding abnormality, like overlarge welding balls or deviation, of a chip testing structure can be avoided, so that stabilizing of process environment for subsequent testing is facilitated.

Description

technical field [0001] The invention relates to a semiconductor process, in particular to a sample processing method applied to abnormal bonding of metal wires in a chip test structure. Background technique [0002] Chip reliability testing can be roughly divided into silicon wafer and packaging. The common packaging chip for testing is a kind of ceramic package base, the chip is pasted in the center, and the metal pad on the chip and the bonding pad on the base are connected by gold wire, aluminum wire or copper wire, and the bonding pad and each part of the base are connected. The pins are in one-to-one correspondence, and finally, the electrical test and reliability verification of the test structure are performed by connecting the pins. The method of connecting the metal wire to the bonding pad and the metal pad uses a bonding method. In the process of pressure welding, the solder balls may be too large and offset due to factors such as unstable process conditions, whi...

AI Technical Summary

Problems solved by technology

Causes a short circuit between each metal pad, making it impossible to perform subsequent tests

Remanufacturing wafers with the same process conditions will cost a lot of manpower and financial resources

If the solder balls are corroded with acid, the aluminum on the metal pad will also be corroded, making subsequent re-bonding and re-testing impossible

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