Image acquisition module and alignment assembly method thereof

Abstract

An image acquisition module and its alignment assembly method, the image acquisition module includes: an image sensing unit and an actuator unit. The image sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate and electrically connected to the circuit substrate. The actuator unit includes a frame housing arranged on the image sensing unit and a movable lens assembly which can be movably arranged in the frame housing. Wherein, the top of the image sensing chip has an image sensing area, the image sensing area has a first geometric center line and a first geometric center point, and the movable lens assembly has a second geometric center line and a second geometric center line center point. Thereby, when the actuator unit is applied with a predetermined energy, the second geometric centerline (or the second geometric center point) of the movable lens assembly will be exactly aligned with the first geometric centerline (or the second geometric center point) of the image sensing area. a geometric center point).

Description

technical field [0001] The present invention relates to an image capturing module (IMAGE CAPTURING MODULE) and its aligning assembly method, especially to an image capturing module that can make the center position of the movable lens assembly accurately align with the center position of the image sensing chip during actual operation. Modules and their alignment assembly method. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pi...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention is to provide an image acquisition module and its alignment assembly method to solve the known problem of “if the actuator can drive the lens to move in the X direction and the Y direction, the lens in the known image acquisition module The center position of the image sensor cannot be effectively and accurately aligned with the defect of the center position of the image sensor

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