Multilayer circuit board and manufacturing method thereof

Abstract

Disclosed is a manufacturing method of a multilayer circuit board. The method comprises the following steps: providing a circuit board substrate comprising a first copper foil layer and a second copper foil layer at outermost two sides, wherein the circuit board substrate comprises a second area; forming multiple conductive through holes electrically connected with the first copper foil layer and the second copper foil layer in the second area; manufacturing the first copper foil layer and the second copper foil layer to form a first conductive line pattern and a second conductive line pattern, wherein the first conductive line pattern comprises multiple conductive terminals in the second area, the second conductive line pattern comprises multiple electroplated connecting lines in the second area, and each conductive terminal is electrically connected with one electroplated connecting line through one conductive through hole; forming coverage film layers at the two sides of the circuit board substrate, wherein the coverage film layer disposed at the surface of the first conductive line pattern is provided with openings, and the multiple conductive terminals are exposed out of the openings; and forming a gold-plated layer on the surfaces of multiple conductive terminals. According to the invention, each electroplated connecting line is disconnected through a laser ablation mode, and the multilayer circuit board is formed accordingly. The invention also provides a multilayer circuit board formed by use of the manufacturing method of the multilayer circuit board.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] At present, many multilayer circuit boards are electrically connected to other electronic devices through gold fingers. Usually, the gold fingers are formed by chemical gold plating or electroplating on the surface of multiple conductive terminals of the circuit board after the circuit is formed. If it is formed in the form of gold, when forming lines on this circuit board, it is necessary to form a plurality of electroplating connections electrically connected to the conductive terminals at the same time as the ends of the plurality of conductive terminals (that is, the end close to the edge of the product). The wire is used for electrical connection with the electroplating device. After the electroplating is completed, the electroplating wire is cut by punching to form a finishe...

AI Technical Summary

Problems solved by technology

When the gold finger end of the circuit board is plugged and pulled out with other electronic devices for many times, the gold plating layer remaining on the surface of the electroplated connection at the end of the conductive terminal is prone to lift and peel off, so that the gold finger end of the circuit board cannot be inserted smoothly. Pulling out and affecting the electrical connection performance of gold fingers and other electronic devices

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