Modular air-cooled chassis structure with enhanced heat dissipation

Abstract

The invention provides a modular air-cooled chassis structure with enhanced heat dissipation, and belongs to the technical field of heat dissipation of electronic equipment. The modular air-cooled chassis structure comprises a chassis frame, a standard electronic module an enhanced heat dissipation module and a ventilation pipe, wherein the standard electronic module, the enhanced heat dissipationmodule and the ventilation pipe are installed in the chassis frame, the front of the chassis frame is provided with a front cover plate, the back is provided with a motherboard, a back cover and a fan box in sequence from inside to outside, and the front cover plate is provided with an air inlet; the enhanced heat dissipation module is butted with the inlet of the ventilation pipe, and the standard electronic module is inserted on the motherboard; the chassis frame is composed of an upper guide rail plate, a lower guide rail plate and two side plates, the upper guide rail plate and the lowerguide rail plate are internally provided with heat dissipation fins, and the upper and lower guide rail plates are provided with ventilation openings at the butt joint with the outlet of the ventilation pipe. The modular air-cooled chassis structure is additionally provided with the enhanced heat dissipation module and the ventilation pipe which are close to the standard electronic module and capable of being quickly plugged in the chassis frame, thereby enhancing the heat dissipation effect of the adjacent standard electronic module, and expanding the heat dissipation capacity of the single standard electronic module to a 150W-200W level.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of electronic equipment, and specifically relates to a modular air-cooled chassis structure for enhanced heat dissipation. Background technique [0002] Existing traditional modular electronic chassis (or "rack") has two types of horizontal heat dissipation and vertical heat dissipation. Both solutions can achieve a certain degree of heat dissipation while isolating the flowing air and the electronic module. [0003] The heat dissipation structure of the modular electronic chassis with horizontal heat dissipation is generally in series, and the main disadvantage lies in the heat superposition effect. Along the direction of air flow, the air cools each electronic module in turn, and the air temperature increases in turn. As a result, the cooling air temperature in the adjacent rail plate of the electronic modules installed at the rear of the air flow has increased considerably, usually b...

AI Technical Summary

Problems solved by technology

[0004] Under the trend of further increasing the working heat of electronic modules, the above-mentioned two schemes of horizontal heat dissipation and vertical heat dissipation have relatively large limitations and are difficult to adapt to

At the same time, the contact surface between the electronic module and the rail plate heat sink is narrow, the heat dissipation path is long, and the temperature rise gradient is extremely large

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