Chip mounter

Abstract

The present invention provides a chip mounter capable of suppressing the vibration of the mounting head itself, which directly affects the mounting accuracy, so that high-precision and high-speed devices such as the chip mounter can be increased. This chip mounter has: a wafer supply part, which supplies wafers for picking up chips; a workpiece supply and conveyance part, which is used to supply and carry substrates; picks up the chip from the wafer supply unit, and mounts the chip on the substrate, and in this chip mounting, the mounting head has a front end for sucking the chip below. , the placement head has a first shock absorber for suppressing vibration in the first direction on its upper side.

Description

technical field

[0001] The present invention relates to a chip mounting machine, in particular to a chip mounting machine with reduced vibration of a mounting head. Background technique

[0002] Among semiconductor manufacturing devices, there is a chip mounter that mounts a semiconductor chip (chip) on a substrate (hereinafter referred to as a substrate) such as a lead frame. In the chip mounter, the chip is vacuum-adsorbed by the mounting head, moved horizontally after rising at a high speed, and then descended and mounted on the substrate.

[0003] Generally, if the speed of the device is increased, the vibration generated by the high-speed moving object will increase, and it will be difficult for the device to obtain the target accuracy due to the vibration. Vibration is the biggest obstacle to achieving both high-speed and high-precision devices.

[0004] As countermeasures against vibration, conventional measures have been taken to increase rigidity and reduce vibrat...

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