Chip mounter

A placement machine, chip technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inability to suppress vibration, and achieve the effect of suppressing vibration

Active Publication Date: 2017-08-25
FASFORD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reverse movement mechanism mounted on the head platform can suppress the vibration applied to the bracket, but it cannot suppress the vibration of the head itself, such as the front end of the head

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] based on Figure 1 to Figure 4 The first embodiment of the present invention will be described.

[0031] figure 1 It is a conceptual diagram seen from above of a die mounter according to an embodiment of the present invention. First, based on figure 1 A basic configuration example of a die mounter will be described. 100 is a die mounter, 11 is a wafer supply unit, 12 is a workpiece supply and transfer unit, 13 is a die mounter, and 200 is a control unit. As described above, the die mounter 100 includes the wafer supply unit 11, the workpiece supply and transfer unit 12, the die attach unit 13, and a control unit that controls these constituent devices (constituent devices including devices not shown). 200 constitutes.

[0032] In the wafer supply unit 11 , 111 is a cassette elevator, and 112 is a pickup device. In addition, in the workpiece supply and conveyance part 12, 121 is a stacker loader, 122 is a frame feeder, and 123 is an unloader. Moreover, in the die ...

Embodiment 2

[0054] The damper in Example 1 is a dynamic damper, and by effectively setting the intrinsic value of the damper, it is possible to cope with a wide range of vibration frequencies.

[0055] for Figure 4 The mounting head 403 of the vibration is set as ν 1 , set the mass to M B . Also, for the shock absorber 450, let the mass be M D , set the natural frequency of vibration to ν D , set the viscosity to C D . At this time, if γ=M D / M B ,but

[0056] ν D = ν 1 / (l+γ),

[0057] From this, the natural frequency of vibration ν is calculated D , viscous C D .

[0058] The above formula is based on "Research on Vibration Control Based on Air Attenuation Control Type Dynamic Damper" written by Kenichiro Tai, Minutes of Institute of Science and Technology, Meiji University, Volume 9, P109-141, 15-Jan-1973.

[0059] According to the above-mentioned embodiment, by effectively setting the intrinsic value of the shock absorber, a wide range of vibration frequencies can be...

Embodiment 3

[0061] The shock absorbers in Example 1 and Example 2 are directed to the Y direction (near side-back side direction) where the vibration is large. But when image 3 Even in the X-direction (upstream-downstream direction) where there is no vibration, the placement head may generate vibration that is smaller than that in the Y-direction but affects accuracy. The damper 550 operates based on the vibration generated when the placement head 403 operates.

[0062] Thus, as shown in this embodiment Figure 5 shown, the settings are useful for Figure 4 The shock absorber 450 for suppressing the vibration in the Y-direction, and the shock absorber 550 for suppressing the vibration in the X-direction are also provided. In addition, in the case of using other methods to suppress vibration in the Y direction or when the vibration in the Y direction does not constitute an obstacle, etc., it is also possible to install a device that only suppresses the vibration in the X direction. F...

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PUM

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Abstract

The present invention provides a chip mounter capable of suppressing the vibration of the mounting head itself, which directly affects the mounting accuracy, so that high-precision and high-speed devices such as the chip mounter can be increased. This chip mounter has: a wafer supply part, which supplies wafers for picking up chips; a workpiece supply and conveyance part, which is used to supply and carry substrates; picks up the chip from the wafer supply unit, and mounts the chip on the substrate, and in this chip mounting, the mounting head has a front end for sucking the chip below. , the placement head has a first shock absorber for suppressing vibration in the first direction on its upper side.

Description

technical field [0001] The present invention relates to a chip mounting machine, in particular to a chip mounting machine with reduced vibration of a mounting head. Background technique [0002] Among semiconductor manufacturing devices, there is a chip mounter that mounts a semiconductor chip (chip) on a substrate (hereinafter referred to as a substrate) such as a lead frame. In the chip mounter, the chip is vacuum-adsorbed by the mounting head, moved horizontally after rising at a high speed, and then descended and mounted on the substrate. [0003] Generally, if the speed of the device is increased, the vibration generated by the high-speed moving object will increase, and it will be difficult for the device to obtain the target accuracy due to the vibration. Vibration is the biggest obstacle to achieving both high-speed and high-precision devices. [0004] As countermeasures against vibration, conventional measures have been taken to increase rigidity and reduce vibrat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/52
Inventor 石井良英
Owner FASFORD TECH
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