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Light-emitting diode and manufacturing method of light-emitting diode

By setting a trench between the electrode pad and the circuit layer in the light-emitting diode and filling it with phosphor, a uniform encapsulation layer is formed, which solves the problem of uneven white light caused by the irregular shape of the encapsulation layer, and achieves consistency of optical path length and Uniformity of white light.

Inactive Publication Date: 2015-03-25
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the shape of the encapsulation layer may be irregular, for example, some places are thicker and some places are thinner, the optical path length of the light passing through the encapsulation layer is different, resulting in uneven white light emitted.

Method used

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] It should be noted that the terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" a...

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PUM

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Abstract

The invention discloses a light-emitting diode and a manufacturing method of the light-emitting diode. The manufacturing method comprises the steps that a bottom layer is included; a circuit layer is formed on the bottom layer; a light-emitting chip is formed on the circuit layer; an electrode pad is formed on the bottom layer and is electrically connected with the light-emitting chip, and first preset gaps are formed between the electrode pad and the circuit layer and between the electrode pad and the light-emitting chip, so that first grooves are formed between the electrode pad and the circuit layer and between the electrode pad and the light-emitting chip, and the horizontal height of the electrode pad is equal to the horizontal height of the light-emitting chip; encapsulating layers including fluorescent powder are formed on the light-emitting chip and the electrode pad, the first groove between the electrode pad and the circuit layer is filled with the corresponding encapsulating layer, and thus an even dome shape is formed.

Description

technical field [0001] The invention relates to the field of light emitting sources, in particular to a light emitting diode and a method for manufacturing the light emitting diode. Background technique [0002] Compared with traditional light sources such as incandescent lamps and fluorescent lamps, LEDs (Light Emitting Diodes) have the characteristics of long service life, low power consumption and high efficiency. dominated on. [0003] In order to enable the LED to generate white light, red and green phosphors can be coated in the packaging layer (for example, epoxy resin layer) of the diode. When the blue chip in the LED emits blue light, the red and green phosphors in the packaging layer The green phosphor will generate red light and green light respectively under the stimulation of blue light. The resulting red and green light mixes with the blue light passing through the encapsulation layer to produce white light. [0004] However, since the shape of the encapsula...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/54
CPCH10H20/01H10H20/8506H10H20/85H10H20/851H10H20/853H10H20/036H10H20/0362H01L2224/45144H01L2224/45147H01L2224/48091H01L2224/45124H01L24/45H01L2924/181H01L2924/12041H01L24/48H10H20/0364H10H20/857H10H20/854H10H20/8512H10H20/8514H01L2224/48101H01L2924/00014H01L2924/00012
Owner TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
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